Supermicro to Showcase Server, Storage, and Networking Products at Computex

June 3, 2014

TAIPEI, Taiwan, June 3 — Super Micro Computer, Inc., a global leader in high-performance, high-efficiency server, storage technology and green computing will showcase its expansive lines of server, storage and networking solutions optimized for Virtualization, Cloud and Enterprise environments as well as Data Center and Big Data this week at Computex in Taipei, Taiwan. Highlights of Supermicro’s new innovations in system architecture and power efficiency include MicroBlade, the extreme low power, ultra high density 6U 112-node Intel Atom C2000 based microserver with four Ethernet Switch modules featuring SDN functionality, the 4U 4-Way, 6TB 96x DIMM SuperServer supporting Intel Xeon E7-8800/4800 v2 processors, a 4U FatTwin 2-node 12x GPU and new leading edge Titanium Level high efficiency (96%) digital power supplies. First-to-market, industry leading I/O accelerated solutions incorporating the latest PCIe NVMe, 12Gb/s SAS3 and blazing fast ULLtraDIMM technologies will also be on display.

“Supermicro offers an unrivaled range of application optimized server, storage and networking building blocks that enable practically limitless configuration possibilities,” said Charles Liang, President and CEO of Supermicro. “With MicroBlade microserver, 4-Way and TwinPro architecture innovations, growing NVMe, SAS3 and UlltraDIMM support, new Titanium Level high-efficiency (96%) digital power supplies and a vast array of UP, DP and MP serverboards we continue our tradition of offering leading edge computing technologies and platforms first-to-market. Our never ending drive to deliver exactly the best solutions raises the standards on performance, energy efficiency and density to advance next generation computing applications industry wide.”

Supermicro Computex 2014 Server, Storage and Networking Solutions

SuperServer Solutions

  • 4U FatTwin — 8x 3.5″ Hot-Swap HDD/SSD per U (SYS-F627R3-RTB+), 12x GPU/Xeon Phi 3x per Node (SYS-F627G2-FT+)
  • 4U 4-Way — Quad Intel Xeon E7-8800/4800 v2 (15-core, 155W) processor support, up to 6TB in 96x DIMMs (SYS-4048B-TRFT)
  • 6U MicroBlade — Ultra low power, extreme density microserver featuring 112x Intel Atom C2750 (8-core, 2.4GHz) nodes, 4x SDN enabled Ethernet switch modules with 2x 40Gb/s QSFP or 8x 10Gb/s SFP+ uplinks and 56x 2.5Gb/s downlinks, up to 99% cable reduction
  • 4U DP — 8x GPU/Xeon Phi, up to 48x 2.5″ hot-swap SAS2/SATA3 HDD bays (SYS-4027GR-TR)
  • 3U MicroCloud — 24x nodes with Intel Xeon E3-1200 v3 or Intel 4th Gen Core processor support, up to 32GB, 2x 2.5″ SATA3 (6Gb/s) HDDs or optional 4x 2.5″ Slim SSDs (SYS-5038ML-H24TRF)
  • 2U TwinPro — 2 nodes each supporting dual Intel Xeon E5-2600 v2 processors, up to 1TB, PCIE-3.0 LP slots 1x (x16) and 1x (x8), 8x hot-swap 2.5″ SATA HHDs/SSDs, dual 10GBase-T ports (SYS-2027PR-DTTR), 4 nodes each supporting dual Intel Xeon E5 2600 v2 processors, up to 1TB, 6x 2.5″ hot-swap HDDs/SSDs, LSI3108 12Gb/s SAS3, 56Gb/s IB FDR (SYS-2027PR-HC1FR)
  • 7U SuperBlade — TwinBlade 2x nodes each supporting dual Intel Xeon E5-2600 v2 processors (SBI-7227R-T2), Storage Blade single node supporting dual Intel Xeon E5-2600v2 processors and 6x HDD/SSD (SBI-7227R-S6), GPU Blade supporting dual Intel Xeon E5-2600 v2 processors, 3x GPU (SXM), 30x GPUs in 7U (SBI-7127RG3)
  • 2U GPU/Xeon Phi — Dual Intel Xeon E5-2600 v2, 6x GPUs (SYS-2027GR-TRFH)
  • 1U DCO — Side-by-side dual Intel Xeon E5-2600 v2 (130W) (SYS-6017R-TDLRF), (130W) (SYS-6017R-TDF), (135W) (SYS-6017R-TDT+)
  • 4U/Tower — NVIDIA Maximus Certified, 5x GPUs (SYS-7047GR-TRF)
  • 2U Hyper-Speed — Dual Intel Xeon E5-2687W v2 processors (150W), up to 1TB in 16x DIMMs featuring ULLtraDIMM technology, Computex demo showcases high IOPS and low jitter (SYS-6027AX-72RF-HFT3)
  • 1U WIO — 8x 12Gb/s SAS3 HDDs & 2x NVMe HDDs/SSDs (SYS-1018R-WC0R, SYS-1027R-WC1NRT)
  • 1U Compact and Cost-Effective — Supports Intel Atom C2550 Soc (14W, 4-Core) processor, up to 64GB ECC/non-ECC Memory, 2x 3.5″ fixed SATA3 HDD bays or optional 4x 2.5″ SATA2 HDDs, 1x PCI-E 2.0 (x8), 1x PCI-E 2.0 (x4), Virtualization ready (SYS- 5018A-MLTN4)
  • Compact BOX PC — CSE-101i Mini-ITX chassis with X10SLV motherboard supporting Intel 4th Gen Core i7/i5/i3, up to 16GB, 1x Mini-PCIe (full and half card with mSATA support), 1x internal 2.5″ HDD bay, 2x GbE, 1x DVI-I, 1x HDMI, 1x Display Port, SATADOM, 80W DC power adapter and VESA mounting bracket (SYS-1018L-MP)
  • 2U A+ AMD — Quad Opteron 6300P, up to 64-Cores, up to 1TB in 32x DIMMs (AS-2042G-72RF4)
  • Tower Gaming System — Gaming chassis (732G-903B) with overclock enabled motherboard (C7Z97-OCE) featuring Intel Core i7-4770K processor, 3100MHz memory, PCIe M.2 SSD — NVIDIA GRID client demo

SuperStorage Solutions

  • 4U Double-Sided Storage — Dual Intel Xeon E5-2600v2 processors, up to 1T in 16x DIMMs, 72x HDD/SSD bays (SSG-6047R-E1R72L2K)
  • 1U Cold Storage — Single Intel Atom C2750 (20W, 8-core) processor, 12x hot-swap 3.5″ HDDs, redundant 400W power supplies (SSG-5018A-AR12L); single power supply option available (SSG-5018A-AS12L)
  • 2U Cluster-in-a-Box (CiB) — Dual node each node includes dual Intel Xeon E5-2403 v2 processors, 64GB memory. Fully populated with 20x 1TB 2.5″ HDDs, 4x 200GB SSDs and Windows Storage Server 2012 R2 Standard preinstalled (SSG-2027B-CIB020H)

Networking Solutions

  • 10GbE Network Switches — 48-Port 10GBase-T (RJ45) (SSE-X3348T), 24-Port (SFP+) (SSE-X24S/SR), 52-Port (PoE) (SSE-G2252P)
  • Internet-of-Things (IoT) Gateway System — Ultra-low power Intel Quark SoC X1020D (2.3W) based, 4″x4″ motherboard (A1SQN), onboard 512MB DDR3 ECC, 2x Mini PCI-E slot Full Length for WiFi, Bluetooth, WWAN 1x ZigBee module socket, 2 x 10/100Mbps RJ45, 1 x RS-232 via DB9, 1x RS485 via screw terminal interface, 1x USB2.0 host, 1x USB2.0 device, 1x Analog Input 8 channel 12-bit MicroSD for OS/Application, 0deg C to +50deg C operation, power adapter (SYS-E100-8Q)

Power Supply & Battery Backup Power (BBP) Solutions

  • NEW 1600W Titanium Level High-Efficiency (96%) Power Supply (PWS-1K68A-1R)
  • BBP Modules — 200W BBP (PWS-206B-1R), 1000W BBP (PWS-1K03B-1R)

UP/DP/MP Motherboards

Low power Intel Atom C2000 20W, 8-core (A1SRi-2758F, A1SAM-2750F), Ultra-low power Intel Quark SoC X1020D (2.3W) based, 4″x4″ motherboard for Internet-of-Things (IoT) Gateway (A1SQN), Intel 3(rd) Gen Core i7 (X9SPV-M4/-3UE), Intel Xeon E3-1125C (X9SKV-1125), Intel Xeon E3-1200 v3, 4th Gen Core i3 (X10SL7-F, X10SLM+-LN4F, X10SLM+-F, X10SLA-F, X10SLL-F, X10SAE), Intel 4th Gen Core i7/i5/i3 (C7B75) with Intel Z97 Express chipset and overclockable (C7Z97-OCE); Dual Intel Xeon E5-2600 v2 X9DRL-7F, X9DRW-7TPF+, X9DRD-EF, X9DRD-CNT+ (8x SAS3 12Gb/s, 4x NVMe ports plus 2GB cache and optional SuperCap backup), X9DRX+-F, X9DRH-7TF; Quad Intel Xeon E5-4600 v2 (12-Core) or E5-4600 (8-Core) X9QR7-TF-JBOD, Quad AMD Opteron 6300P (Socket G34) 16/12/8/4-Core ready H8QG7-LN4F

Visit Supermicro at Computex in Taipei, Taiwan, June 3(rd) through the 7(th) at the Taipei World Trade Center (TWTC), Nangang Exhibition Hall, 4(th) Floor, Booth #M0110.

For more information on Supermicro’s complete range of high performance, high-efficiency Server, Storage and Networking solutions, visit www.supermicro.com.

About Super Micro Computer, Inc.

Supermicro, the leading innovator in high-performance, high-efficiency server technology is a premier provider of advanced server Building Block Solutions for Data Center, Cloud Computing, Enterprise IT, Hadoop/Big Data, HPC and Embedded Systems worldwide. Supermicro is committed to protecting the environment through its “We Keep IT Green” initiative and provides customers with the most energy-efficient, environmentally-friendly solutions available on the market.

Source: Super Micro Computer, Inc.

Subscribe to HPCwire's Weekly Update!

Be the most informed person in the room! Stay ahead of the tech trends with industy updates delivered to you every week!

Takeaways from the Milwaukee HPC User Forum

September 19, 2017

Milwaukee’s elegant Pfister Hotel hosted approximately 100 attendees for the 66th HPC User Forum (September 5-7, 2017). In the original home city of Pabst Blue Ribbon and Harley Davidson motorcycles the agenda addresse Read more…

By Merle Giles

NSF Awards $10M to Extend Chameleon Cloud Testbed Project

September 19, 2017

The National Science Foundation has awarded a second phase, $10 million grant to the Chameleon cloud computing testbed project led by University of Chicago with partners at the Texas Advanced Computing Center (TACC), Ren Read more…

By John Russell

NERSC Simulations Shed Light on Fusion Reaction Turbulence

September 19, 2017

Understanding fusion reactions in detail – particularly plasma turbulence – is critical to the effort to bring fusion power to reality. Recent work including roughly 70 million hours of compute time at the National E Read more…

HPE Extreme Performance Solutions

HPE Prepares Customers for Success with the HPC Software Portfolio

High performance computing (HPC) software is key to harnessing the full power of HPC environments. Development and management tools enable IT departments to streamline installation and maintenance of their systems as well as create, optimize, and run their HPC applications. Read more…

Kathy Yelick Charts the Promise and Progress of Exascale Science

September 15, 2017

On Friday, Sept. 8, Kathy Yelick of Lawrence Berkeley National Laboratory and the University of California, Berkeley, delivered the keynote address on “Breakthrough Science at the Exascale” at the ACM Europe Conferen Read more…

By Tiffany Trader

Takeaways from the Milwaukee HPC User Forum

September 19, 2017

Milwaukee’s elegant Pfister Hotel hosted approximately 100 attendees for the 66th HPC User Forum (September 5-7, 2017). In the original home city of Pabst Blu Read more…

By Merle Giles

Kathy Yelick Charts the Promise and Progress of Exascale Science

September 15, 2017

On Friday, Sept. 8, Kathy Yelick of Lawrence Berkeley National Laboratory and the University of California, Berkeley, delivered the keynote address on “Breakt Read more…

By Tiffany Trader

DARPA Pledges Another $300 Million for Post-Moore’s Readiness

September 14, 2017

The Defense Advanced Research Projects Agency (DARPA) launched a giant funding effort to ensure the United States can sustain the pace of electronic innovation vital to both a flourishing economy and a secure military. Under the banner of the Electronics Resurgence Initiative (ERI), some $500-$800 million will be invested in post-Moore’s Law technologies. Read more…

By Tiffany Trader

IBM Breaks Ground for Complex Quantum Chemistry

September 14, 2017

IBM has reported the use of a novel algorithm to simulate BeH2 (beryllium-hydride) on a quantum computer. This is the largest molecule so far simulated on a quantum computer. The technique, which used six qubits of a seven-qubit system, is an important step forward and may suggest an approach to simulating ever larger molecules. Read more…

By John Russell

Cubes, Culture, and a New Challenge: Trish Damkroger Talks about Life at Intel—and Why HPC Matters More Than Ever

September 13, 2017

Trish Damkroger wasn’t looking to change jobs when she attended SC15 in Austin, Texas. Capping a 15-year career within Department of Energy (DOE) laboratories, she was acting Associate Director for Computation at Lawrence Livermore National Laboratory (LLNL). Her mission was to equip the lab’s scientists and research partners with resources that would advance their cutting-edge work... Read more…

By Jan Rowell

EU Funds 20 Million Euro ARM+FPGA Exascale Project

September 7, 2017

At the Barcelona Supercomputer Centre on Wednesday (Sept. 6), 16 partners gathered to launch the EuroEXA project, which invests €20 million over three-and-a-half years into exascale-focused research and development. Led by the Horizon 2020 program, EuroEXA picks up the banner of a triad of partner projects — ExaNeSt, EcoScale and ExaNoDe — building on their work... Read more…

By Tiffany Trader

MIT-IBM Watson AI Lab Targets Algorithms, AI Physics

September 7, 2017

Investment continues to flow into artificial intelligence research, especially in key areas such as AI algorithms that promise to move the technology from speci Read more…

By George Leopold

Need Data Science CyberInfrastructure? Check with RENCI’s xDCI Concierge

September 6, 2017

For about a year the Renaissance Computing Institute (RENCI) has been assembling best practices and open source components around data-driven scientific researc Read more…

By John Russell

How ‘Knights Mill’ Gets Its Deep Learning Flops

June 22, 2017

Intel, the subject of much speculation regarding the delayed, rewritten or potentially canceled “Aurora” contract (the Argonne Lab part of the CORAL “ Read more…

By Tiffany Trader

Reinders: “AVX-512 May Be a Hidden Gem” in Intel Xeon Scalable Processors

June 29, 2017

Imagine if we could use vector processing on something other than just floating point problems.  Today, GPUs and CPUs work tirelessly to accelerate algorithms Read more…

By James Reinders

NERSC Scales Scientific Deep Learning to 15 Petaflops

August 28, 2017

A collaborative effort between Intel, NERSC and Stanford has delivered the first 15-petaflops deep learning software running on HPC platforms and is, according Read more…

By Rob Farber

Russian Researchers Claim First Quantum-Safe Blockchain

May 25, 2017

The Russian Quantum Center today announced it has overcome the threat of quantum cryptography by creating the first quantum-safe blockchain, securing cryptocurrencies like Bitcoin, along with classified government communications and other sensitive digital transfers. Read more…

By Doug Black

Oracle Layoffs Reportedly Hit SPARC and Solaris Hard

September 7, 2017

Oracle’s latest layoffs have many wondering if this is the end of the line for the SPARC processor and Solaris OS development. As reported by multiple sources Read more…

By John Russell

Google Debuts TPU v2 and will Add to Google Cloud

May 25, 2017

Not long after stirring attention in the deep learning/AI community by revealing the details of its Tensor Processing Unit (TPU), Google last week announced the Read more…

By John Russell

Six Exascale PathForward Vendors Selected; DoE Providing $258M

June 15, 2017

The much-anticipated PathForward awards for hardware R&D in support of the Exascale Computing Project were announced today with six vendors selected – AMD Read more…

By John Russell

Top500 Results: Latest List Trends and What’s in Store

June 19, 2017

Greetings from Frankfurt and the 2017 International Supercomputing Conference where the latest Top500 list has just been revealed. Although there were no major Read more…

By Tiffany Trader

Leading Solution Providers

IBM Clears Path to 5nm with Silicon Nanosheets

June 5, 2017

Two years since announcing the industry’s first 7nm node test chip, IBM and its research alliance partners GlobalFoundries and Samsung have developed a proces Read more…

By Tiffany Trader

Nvidia Responds to Google TPU Benchmarking

April 10, 2017

Nvidia highlights strengths of its newest GPU silicon in response to Google's report on the performance and energy advantages of its custom tensor processor. Read more…

By Tiffany Trader

Graphcore Readies Launch of 16nm Colossus-IPU Chip

July 20, 2017

A second $30 million funding round for U.K. AI chip developer Graphcore sets up the company to go to market with its “intelligent processing unit” (IPU) in Read more…

By Tiffany Trader

Google Releases Deeplearn.js to Further Democratize Machine Learning

August 17, 2017

Spreading the use of machine learning tools is one of the goals of Google’s PAIR (People + AI Research) initiative, which was introduced in early July. Last w Read more…

By John Russell

EU Funds 20 Million Euro ARM+FPGA Exascale Project

September 7, 2017

At the Barcelona Supercomputer Centre on Wednesday (Sept. 6), 16 partners gathered to launch the EuroEXA project, which invests €20 million over three-and-a-half years into exascale-focused research and development. Led by the Horizon 2020 program, EuroEXA picks up the banner of a triad of partner projects — ExaNeSt, EcoScale and ExaNoDe — building on their work... Read more…

By Tiffany Trader

Cray Moves to Acquire the Seagate ClusterStor Line

July 28, 2017

This week Cray announced that it is picking up Seagate's ClusterStor HPC storage array business for an undisclosed sum. "In short we're effectively transitioning the bulk of the ClusterStor product line to Cray," said CEO Peter Ungaro. Read more…

By Tiffany Trader

Amazon Debuts New AMD-based GPU Instances for Graphics Acceleration

September 12, 2017

Last week Amazon Web Services (AWS) streaming service, AppStream 2.0, introduced a new GPU instance called Graphics Design intended to accelerate graphics. The Read more…

By John Russell

GlobalFoundries: 7nm Chips Coming in 2018, EUV in 2019

June 13, 2017

GlobalFoundries has formally announced that its 7nm technology is ready for customer engagement with product tape outs expected for the first half of 2018. The Read more…

By Tiffany Trader

  • arrow
  • Click Here for More Headlines
  • arrow
Share This