TYAN Launches AMD EPYC 7002 Series Processor-Based HPC and Storage Server Platforms at SC19

November 18, 2019

DENVER, Colo.,  Nov 18, 2019 – TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, rolled out the latest lineup of HPC and storage server platforms based on the AMD EPYC 7002 Series processors that are aimed at the datacenter market at SC19 in Denver, Colorado, November 18-21.

Image courtesy TYAN.

“Leveraging AMD’s innovation in 7nm process technology, PCIe 4.0 I/O, and an embedded security architecture, TYAN’s new 2nd Gen AMD EPYC processor-based platforms are designed to address the most demanding challenges facing the datacenter”, said Danny Hsu, Vice President of MiTAC Computing Technology Corporation’s TYAN Business Unit. “Datacenter customers can transform their infrastructure with our latest HPC and storage solutions to drive performance and reduce bottlenecks.”

“The 2nd Gen AMD EPYC processor was designed to provide customers with leadership in architecture, performance, and security,” said Scott Aylor, corporate vice president and general manager, Data Center Solutions Group, AMD. “We’re excited to see our partners, like TYAN, continue to build their portfolios around 2nd Gen EPYC to provide new capabilities for their customers and partners.”

Transport HX Product Line to Scale the Most Demanding HPC and AI Applications

Powered by dual AMD EPYC 7002 Series processors, TYAN’s Transport HX product line is designed to deliver exceptional performance for most demanding and mission-critical workloads. TYAN’s 2U Transport HX TN83-B8251 server platform features support for eight 3.5” hot-swap SATA or NVMe U.2 tool-less drive bays, and is ideal for AI training and inference applications deploying 4 double-width or 8 single-width GPU cards, and 2 PCIe 4.0 x16 high-speed networking cards.

The Transport HX TS75-B8252 and Transport HX TS75A-B8252 are 2U server platforms with support for 32 DIMM slots and up to 9 PCIe 4.0 slots. Both server platforms are optimized for HPC and Virtualization applications. The TS75-B8252 accommodates 12 hot-swap, tool-less 3.5” drive bays with 4 supporting NVMe U.2 drives; TS75A-B8252 accommodates 26 hot-swap, tool-less 2.5” drive bays with 8 supporting NVMe U.2 drives.

Transport SX Product Line to Satisfy Data-driven Workloads

Designed for data-intensive workloads, TYAN’s Transport SX product line supports the single-socket AMD EPYC 7002 Series processor and provides a reliable, cost-effective server-based storage solution for prevailing software defined storage implementations. TYAN’s Transport SX TS65-S8036 is a 2U storage server with support for 16 DDR4-3200 DIMM slots, 12 front-access 3.5” and 2 rear-access 2.5” hot-swap, tool-less drive bays for data storage applications, the 12 front drive bays are pre-configured to support 10 SATA and 2 NVMe U.2 drives. The Transport SX TS65A-S8036 is the other 2U implementation, which supports 26 front-access and 2 rear-access 2.5” hot-swap, tool-less drive bays for high-performance data streaming applications, the 26 front drive bays can be configured as 26 SATA, or 10 SATA and 16 NVMe U.2 drives.

As high density servers with power-efficient computing feature demands are growing in CSP IT infrastructure, TYAN’s Transport SX GC68-B8036 and Transport SX GC68A-B8036 are both 1U servers optimized for typical CSP implementation scenarios. GC68-B8036 is a self-contained server supporting four 3.5” and four 2.5” hot-swap, tool-less drive bays that meet most compute and storage requirements; GC68A-B8036 supports twelve 2.5” hot-swap, tool-less drive bays and by deploying 12 NVMe U.2 drives. The system provides outstanding I/O performance for data streaming applications.

TYAN Product Exhibits @SC19

HPC Platforms:

  • Transport HX TN83-B8251: 2U dual-socket AMD EPYC 7002 Series Processor-based platform supports 16 DDR4-3200 DIMM slots, 4 double-width PCIe 4.0 x16 GPU card slots, 2 spare PCIe 4.0 x16 slots, and eight 3.5” hot-swap, tool-less SATA / NVMe U.2 drive bays
  • Transport HX TS75-B8252: 2U dual-socket AMD EPYC 7002 Series Processor-based platform supports 32 DDR4-3200 DIMM slots, 9 PCIe 4.0 x8 slots (2 double-width, active-cooled professional GPU cards are supported by configuration), and twelve 3.5” hot-swap, tool-less SATA drive bays with 4 bays supporting NVMe U.2 drives by configuration
  • Transport HX TS75A-B8252: 2U dual-socket AMD EPYC 7002 Series Processor-based platform supports 32 DDR4-3200 DIMM slots, 9 PCIe 4.0 x8 slots (2 double-width, active-cooled professional GPU cards are supported by configuration), and 26 hot-swap, tool-less 2.5” SATA drive bays with 8 bays supporting NVMe U.2 drives by configuration

Storage Platforms:

  • Transport SX TS65-B8036: 2U single-socket AMD EPYC 7002 Series Processor-based platform supports 16 DDR4-3200 DIMM slots, 5 PCIe 4.0 x8 slots, 1 OCP 2.0 LAN mezzanine slot, 12 front-access hot-swap, tool-less 3.5” drive bays with 2 bays supporting NVMe U.2 drives by configuration, and two 2.5” rear-access hot-swap, tool-less SATA drive bays
  • Transport SX TS65A-S8036: 2U single-socket AMD EPYC 7002 Series Processor-based platform supports 16 DDR4-3200 DIMM slots, 5 PCIe 4.0 x8 slots, 1 OCP 2.0 LAN mezzanine slot, 26 front-access hot-swap, tool-less 2.5”drive bays with 16 bays supporting NVMe U.2 drives by configuration, and two 2.5” rear-access hot-swap, tool-less SATA drive bays
  • Transport SX GC68-B8036: 1U single-socket AMD EPYC 7002 Series Processor-based platform supports 16 DDR4-3200 DIMM slots, 2 PCIe 4.0 x16 slots, 1 OCP 2.0 LAN mezzanine slot, four 3.5” SATA drive bays and four 2.5” NVMe U.2 drive bays. All drive bays are tool-less and hot-swappable
  • Transport SX GC68A-B8036: 1U single-socket AMD EPYC 7002 Series Processor-based platform supports 16 DDR4-3200 DIMM slots, 2 PCIe 4.0 x16 slots, 1 OCP 2.0 LAN mezzanine slot, twelve 2.5” hot-swap, tool-less drive bays. The 12 drive bays support SAS/SATA or NVMe U.2 drives by configuration

Server Motherboards:

  • Tomcat SX S8036: single-socket AMD EPYC 7002 Series Processor-based server motherboard in EATX (12” x 13”) form factor supports 16 DDR4-3200 DIMM slots, 2 PCIe 4.0 x24 slots for risers, 8 PCIe 4.0 x8 SlimSAS connectors, 2 PCIe 4.0 NVMe M.2, and 1 OCP 2.0 LAN mezzanine slot for rack-optimized server deployment
  • Tomcat HX S8030: single-socket AMD EPYC 7002 Series Processor-based server motherboard in ATX (12” x 9.6”) form factor supports 8 DDR4-3200 DIMM slots, 5 PCIe 4.0 x16 slots, 2 PCIe 4.0 x8 SlimSAS connectors, and 2 PCIe 4.0 NVMe M.2 for compact GPGPU server or CSP entry server deployment
  • Tomcat EX S8020: single-socket 2nd Gen AMD Ryzen Threadripper Processor-based workstation motherboard in ATX (12” x 9.6”) form factor supports 8 DDR4-2933 DIMM slots, 4 PCIe 3.0 x16 slots, and 2 PCIe 3.0 NVMe M.2 for compact data science workstation deployment

About TYAN

TYAN, as a leading server brand of MiTAC Computing Technology Corporation under the MiTAC Group, designs, manufactures and markets advanced x86 and x86-64 server/workstation board technology, platforms and server solution products. Its products are sold to OEMs, VARs, System Integrators and Resellers worldwide for a wide range of applications. TYAN enables its customers to be technology leaders by providing scalable, highly-integrated, and reliable products for a wide range of applications such as server appliances and solutions for HPC, hyper-scale/data center, server storage and security appliance markets. For more information, visit MiTAC’s website at http://www.mic-holdings.com or TYAN’s website at http://www.tyan.com


Source: TYAN 

Subscribe to HPCwire's Weekly Update!

Be the most informed person in the room! Stay ahead of the tech trends with industy updates delivered to you every week!

Focused on ‘Silicon TAM,’ Intel Puts Gary Patton, Former GlobalFoundries CTO, in Charge of Design Enablement

December 12, 2019

Change within Intel’s upper management – and to its company mission – has continued as a published report has disclosed that chip technology heavyweight Gary Patton, GlobalFoundries’ CTO and R&D SVP as well a Read more…

By Doug Black

Quantum Bits: Rigetti Debuts New Gates, D-Wave Cuts NEC Deal, AWS Jumps into the Quantum Pool

December 12, 2019

There’s been flurry of significant news in the quantum computing world. Yesterday, Rigetti introduced a new family of gates that reduces circuit depth required on some problems and D-Wave struck a deal with NEC to coll Read more…

By John Russell

How Formula 1 Used Cloud HPC to Build the Next Generation of Racing

December 12, 2019

Formula 1, Rob Smedley explained, is maybe the biggest racing spectacle in the world, with five hundred million fans tuning in for every race. Smedley, a chief engineer with Formula 1’s performance engineering and anal Read more…

By Oliver Peckham

RPI Powers Up ‘AiMOS’ AI Supercomputer

December 11, 2019

Designed to push the frontiers of computing chip and systems performance optimized for AI workloads, an 8 petaflops (Linpack) IBM Power9-based supercomputer has been unveiled in upstate New York that will be used by IBM Read more…

By Doug Black

At SC19: Developing a Digital Twin

December 11, 2019

In the not too distant future, we can expect to see our skies filled with unmanned aerial vehicles (UAVs) delivering packages, maybe even people, from location to location. In such a world, there will also be a digital twin for each UAV in the fleet: a virtual model that will follow the UAV through its existence, evolving with time. Read more…

By Aaron Dubrow

AWS Solution Channel

Making High Performance Computing Affordable and Accessible for Small and Medium Businesses with HPC on AWS

High performance computing (HPC) brings a powerful set of tools to a broad range of industries, helping to drive innovation and boost revenue in finance, genomics, oil and gas extraction, and other fields. Read more…

IBM Accelerated Insights

GPU Scheduling and Resource Accounting: The Key to an Efficient AI Data Center

[Connect with LSF users and learn new skills in the IBM Spectrum LSF User Community!]

GPUs are the new CPUs

GPUs have become a staple technology in modern HPC and AI data centers. Read more…

Supercomputers Help Predict Carbon Dioxide Levels

December 10, 2019

The Earth’s terrestrial ecosystems – its lands, forests, jungles and so on – are crucial “sinks” for atmospheric carbon, holding nearly 30 percent of our annual CO2 emissions as they breathe in the carbon-rich Read more…

By Oliver Peckham

Focused on ‘Silicon TAM,’ Intel Puts Gary Patton, Former GlobalFoundries CTO, in Charge of Design Enablement

December 12, 2019

Change within Intel’s upper management – and to its company mission – has continued as a published report has disclosed that chip technology heavyweight G Read more…

By Doug Black

RPI Powers Up ‘AiMOS’ AI Supercomputer

December 11, 2019

Designed to push the frontiers of computing chip and systems performance optimized for AI workloads, an 8 petaflops (Linpack) IBM Power9-based supercomputer has Read more…

By Doug Black

At SC19: Developing a Digital Twin

December 11, 2019

In the not too distant future, we can expect to see our skies filled with unmanned aerial vehicles (UAVs) delivering packages, maybe even people, from location to location. In such a world, there will also be a digital twin for each UAV in the fleet: a virtual model that will follow the UAV through its existence, evolving with time. Read more…

By Aaron Dubrow

Intel’s Jim Clarke on its New Cryo-controller and why Intel isn’t Late to the Quantum Party

December 9, 2019

Intel today introduced the ‘first-of-its-kind’ cryo-controller chip for quantum computing and previewed a cryo-prober tool for characterizing quantum proces Read more…

By John Russell

On the Spack Track @SC19

December 5, 2019

At the annual supercomputing conference, SC19 in Denver, Colorado, there were Spack events each day of the conference. As a reflection of its grassroots heritage, nine sessions were planned by more than a dozen thought leaders from seven organizations, including three U.S. national Department of Energy (DOE) laboratories and Sylabs... Read more…

By Elizabeth Leake

Intel’s New Hyderabad Design Center Targets Exascale Era Technologies

December 3, 2019

Intel's Raja Koduri was in India this week to help launch a new 300,000 square foot design and engineering center in Hyderabad, which will focus on advanced com Read more…

By Tiffany Trader

AWS Debuts 7nm 2nd-Gen Graviton Arm Processor

December 3, 2019

The “x86 Big Bang,” in which market dominance of the venerable Intel CPU has exploded into fragments of processor options suited to varying workloads, has n Read more…

By Doug Black

Ride on the Wild Side – Squyres SC19 Mars Rovers Keynote

December 2, 2019

Reminding us of the deep and enabling connection between HPC and modern science is an important part of the SC Conference mission. And yes, HPC is a science its Read more…

By John Russell

Using AI to Solve One of the Most Prevailing Problems in CFD

October 17, 2019

How can artificial intelligence (AI) and high-performance computing (HPC) solve mesh generation, one of the most commonly referenced problems in computational engineering? A new study has set out to answer this question and create an industry-first AI-mesh application... Read more…

By James Sharpe

D-Wave’s Path to 5000 Qubits; Google’s Quantum Supremacy Claim

September 24, 2019

On the heels of IBM’s quantum news last week come two more quantum items. D-Wave Systems today announced the name of its forthcoming 5000-qubit system, Advantage (yes the name choice isn’t serendipity), at its user conference being held this week in Newport, RI. Read more…

By John Russell

DARPA Looks to Propel Parallelism

September 4, 2019

As Moore’s law runs out of steam, new programming approaches are being pursued with the goal of greater hardware performance with less coding. The Defense Advanced Projects Research Agency is launching a new programming effort aimed at leveraging the benefits of massive distributed parallelism with less sweat. Read more…

By George Leopold

Ayar Labs to Demo Photonics Chiplet in FPGA Package at Hot Chips

August 19, 2019

Silicon startup Ayar Labs continues to gain momentum with its DARPA-backed optical chiplet technology that puts advanced electronics and optics on the same chip Read more…

By Tiffany Trader

SC19: IBM Changes Its HPC-AI Game Plan

November 25, 2019

It’s probably fair to say IBM is known for big bets. Summit supercomputer – a big win. Red Hat acquisition – looking like a big win. OpenPOWER and Power processors – jury’s out? At SC19, long-time IBMer Dave Turek sketched out a different kind of bet for Big Blue – a small ball strategy, if you’ll forgive the baseball analogy... Read more…

By John Russell

Cray, Fujitsu Both Bringing Fujitsu A64FX-based Supercomputers to Market in 2020

November 12, 2019

The number of top-tier HPC systems makers has shrunk due to a steady march of M&A activity, but there is increased diversity and choice of processing compon Read more…

By Tiffany Trader

Crystal Ball Gazing: IBM’s Vision for the Future of Computing

October 14, 2019

Dario Gil, IBM’s relatively new director of research, painted a intriguing portrait of the future of computing along with a rough idea of how IBM thinks we’ Read more…

By John Russell

Intel Debuts New GPU – Ponte Vecchio – and Outlines Aspirations for oneAPI

November 17, 2019

Intel today revealed a few more details about its forthcoming Xe line of GPUs – the top SKU is named Ponte Vecchio and will be used in Aurora, the first plann Read more…

By John Russell

Leading Solution Providers

SC 2019 Virtual Booth Video Tour

AMD
AMD
CEJN
CJEN
ONE STOP SYSTEMS
ONE STOP SYSTEMS
PANASAS
PANASAS
SIX NINES IT
SIX NINES IT
VERNE GLOBAL
VERNE GLOBAL
WEKAIO
WEKAIO

Kubernetes, Containers and HPC

September 19, 2019

Software containers and Kubernetes are important tools for building, deploying, running and managing modern enterprise applications at scale and delivering enterprise software faster and more reliably to the end user — while using resources more efficiently and reducing costs. Read more…

By Daniel Gruber, Burak Yenier and Wolfgang Gentzsch, UberCloud

Dell Ramps Up HPC Testing of AMD Rome Processors

October 21, 2019

Dell Technologies is wading deeper into the AMD-based systems market with a growing evaluation program for the latest Epyc (Rome) microprocessors from AMD. In a Read more…

By John Russell

Cray Wins NNSA-Livermore ‘El Capitan’ Exascale Contract

August 13, 2019

Cray has won the bid to build the first exascale supercomputer for the National Nuclear Security Administration (NNSA) and Lawrence Livermore National Laborator Read more…

By Tiffany Trader

SC19: Welcome to Denver

November 17, 2019

A significant swath of the HPC community has come to Denver for SC19, which began today (Sunday) with a rich technical program. As is customary, the ribbon cutt Read more…

By Tiffany Trader

When Dense Matrix Representations Beat Sparse

September 9, 2019

In our world filled with unintended consequences, it turns out that saving memory space to help deal with GPU limitations, knowing it introduces performance pen Read more…

By James Reinders

Cerebras to Supply DOE with Wafer-Scale AI Supercomputing Technology

September 17, 2019

Cerebras Systems, which debuted its wafer-scale AI silicon at Hot Chips last month, has entered into a multi-year partnership with Argonne National Laboratory and Lawrence Livermore National Laboratory as part of a larger collaboration with the U.S. Department of Energy... Read more…

By Tiffany Trader

With the Help of HPC, Astronomers Prepare to Deflect a Real Asteroid

September 26, 2019

For years, NASA has been running simulations of asteroid impacts to understand the risks (and likelihoods) of asteroids colliding with Earth. Now, NASA and the European Space Agency (ESA) are preparing for the next, crucial step in planetary defense against asteroid impacts: physically deflecting a real asteroid. Read more…

By Oliver Peckham

Jensen Huang’s SC19 – Fast Cars, a Strong Arm, and Aiming for the Cloud(s)

November 20, 2019

We’ve come to expect Nvidia CEO Jensen Huang’s annual SC keynote to contain stunning graphics and lively bravado (with plenty of examples) in support of GPU Read more…

By John Russell

  • arrow
  • Click Here for More Headlines
  • arrow
Do NOT follow this link or you will be banned from the site!
Share This