Expected to draw hundreds of attendees from across the industry, the 32nd annual ASMC will feature discussions on the global COVID-19 pandemic’s impact on manufacturing leadership, semiconductor market trends, heterogenous integration and quantum computing.
ASMC is the premier event for industry professionals to network and share insights into best practices for semiconductor manufacturing. The conference is co-chaired by Dr. Ishtiaq Ahsan of IBM and Alexa Greer of KLA.
ASMC 2021 Keynotes and Invited Presentations
Dr. Gary L. Patton, Corporate VP, General Manager of Design Enablement, Intel
Requirements for Manufacturing Leadership in the Post-Pandemic Era
Dr. John Pellerin, VP and Chief Technologist, GLOBALFOUNDRIES
A Reflection on the Impact of the Pandemic on the Semiconductor Industry
Robert Maire, President, Semiconductor Advisors
Emerging Trends in the Global Semiconductor Market
Dr. Mukta Farooq, Distinguished Research Staff Member, IBM Research
Heterogeneous Integration Developments
Dr. Lester Lampert, Research Engineer, Intel
Quantum Computing Tutorial
Christian Dieseldorff, Senior Principal for Semiconductors at Industry Research, SEMI
Semiconductor Manufacturing Market Trends
ASMC 2021 technical sessions will cover topics including:
- Advanced Equipment Processes and Materials
- Advanced Metrology
- Advanced Patterning / Design for Manufacturability
- Advanced Semiconductor Developments
- Advanced Process Control
- Contamination-Free Manufacturing
- Data Management
- Defect Inspection & Reduction
- Equipment Optimization
- Fabless Experience
- Factory Automation
- Industrial Engineering
- Innovative Silicon Devices and Processes
- Non-Silicon/Non-CMOS processing
- Patterning and 3D Metrology
- Smart Manufacturing
- Yield Enhancement
- Yield Methodologies
A workforce development panel discussion with executives from CITI, NY Creates, RIT, TSMC and ST Microelectronics will be moderated by Ed Sperling, editor-in-chief at Semiconductor Engineering.
ASMC 2021 is the fourth of eight conferences comprising SEMI’s third annual Technology Leadership Series of the Americas. This coast-to-coast series provides a platform to foster critical discussions on short- and long-term influences as well as technical and business opportunities in the more than $2 trillion electronics supply chain.
For more conference details, contact Paul Cohen at [email protected].
SEMI connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more.