Sectors » Manufacturing
The freshly minted Dell EMC division of Dell Technologies is on a mission to take HPC mainstream with a strategy that hinges on engineered solutions, beginning with a focus on three industry verticals: manufacturing, research and life sciences. “Unlike traditional HPC where everybody bought parts, assembled parts and ran the workloads and did iterative engineering, we want folks to focus on time to innovation and let us worry about the infrastructure,” said Jim Ganthier, senior vice president, validated solutions organization at Dell EMC Converged Platforms Solution Division.
Pairing ferroelectric and ferrimagnetic materials so that their alignment can be controlled with a small electric field at near room temperatures has long been challenging. In the latest issue of Nature, a group of researchers from Lawrence Berkley National Lab and Cornell University reports progress that could lead to ultra low-power microprocessors, storage devices and Read more…
Sept. 28 — The Fortissimo 2 consortium announced the launch of its Second Open Call for proposals. The Fortissimo 2 project (Horizon 2020 contract 6804811) is funding a set of experiments (sub-projects) to extend and demonstrate the business potential of an ecosystem for HPC-Cloud services, specifically for applications involving simulation of coupled physical processes or Read more…
SGI, the supercomputing vendor recently acquired by HPE, has teamed with ANSYS, the product engineering and simulation software company, to set a new world record for scaling commercial CAE code. According to SGI, the two companies broke a record set last year by running ANSYS Fluent combustion modeling software across 145,000 CPU cores, exceeding by Read more…
KEFLAVIK, Iceland, Sept. 22 — Verne Global, a global developer at the forefront of data center infrastructure design, has announced Volkswagen is moving more than 1 MW of high performance computing (HPC) applications to Verne Global’s data center campus in Iceland. The company will take advantage of Verne Global’s hybrid data center approach – with variable resiliency Read more…
Throughout the past year, the National Center for Supercomputing Applications has been celebrating its 30th anniversary. On Friday, Larry Smarr, whose unsolicited 1983 proposal to the National Science Foundation (NSF) begat NCSA in 1985 and helped spur NSF to create not one but five national centers for supercomputing, gave a celebratory talk at NCSA.
DataDirect Networks (DDN) today introduced a third member to its WOS object storage product line, the WOS 8460, aimed at active archive and collaboration use cases. Object storage, once mainly restricted to ‘cold’ archives for large quantities of unstructured data – think content delivery networks (CDN) used in conjunction with the web – has been slowly expanding its footprint into other application areas. The new DDN product fills out the company’s object storage portfolio and is positioned between DDN’s WOS 9660 offering, intended more for traditional ‘cold’ archives, and WOS 7000, which is well suited for embedded applications such as use with S3.
LIVERMORE, Calif., Sept. 8 — The U.S. Department of Energy’s (DOE) High Performance Computing for Manufacturing program, designed to spur the use of national lab supercomputing resources and expertise to advance innovation in energy efficient manufacturing, is seeking a new round of proposals from industry to compete for $3 million. The High Performance Computing for Manufacturing (HPC4Mfg) Read more…
Sept. 7 — Huawei signed a Memorandum of Understanding (MoU) with Paris-based ESI Group (ESI) at HUAWEI CONNECT 2016 in Shanghai recently. The two parties will collaborate on High-Performance Computing (HPC) and cloud computing to provide innovative industrial manufacturing solutions for customers worldwide. They also jointly released a white paper on the Huawei HPC platform-based Read more…
Forget for a moment the prevailing high anxiety over Moore’s Law’s fate. In the near-term – which could easily mean a decade – CMOS will remain the only viable, volume technology driving computing. Pursue alternatives? Of course, urged Josh Fryman, principal engineer and engineering manager, Intel.
AMD and its primary fab partner GlobalFoundries have signed an updated five-year wafer supply agreement that will extend through the end of 2020. The restructuring simultaneously deepens the commitment between the partners and gives AMD limited freedom to see other…
The Department of Energy’s (DOE) High Performance Computing for Manufacturing (HPC4Mfg) program, roughly a year old, continues to gather momentum with the recent award of $3.8M for 13 new industry projects. More effective collaboration with and transfer of HPC knowledge to industry is a growing imperative at DOE and aligned with the National Strategic Computing Read more…
Aug. 16 — Researchers from commercial and industrial property insurer FM Global want to improve fire protection standards across the country. The company, which insures one in three Fortune 1000 companies with a unique focus on helping clients prevent losses, is dedicated to understanding how fires spread and, conversely, how they can be contained. To Read more…
ARM Ltd has agreed to be bought by Japanese technology company SoftBank for $32B according to both companies. ARM-based chips are already dominant players in the mobile computing market and recently efforts to push ARM processors into servers, including HPC, have gained momentum. For example, Japan’s next flagship supercomputer, the post K Computer, will be Read more…
Momentum for open source hardware made a significant advance this week with the launch of startup SiFive and its open source chip platforms based on the RISC-V instruction set architecture. The founders of the fabless semiconductor company — Krste Asanovic, Andrew Waterman, and Yunsup Lee — invented the free and open RISC-V ISA at the University of California, Berkeley, six years ago. The progression of RISC-V and the launch of SiFive opens the door to a new way of chip building that skirts prohibitive licensing costs and lowers the barrier to entry…
June 27 — The San Diego Supercomputer Center (SDSC) at the University of California San Diego will participate in a comprehensive national initiative announced by the White House this week to spur advances in digital process controls to improve the efficiency of U.S. manufacturing. UC Berkeley, UC Irvine, and UC Los Angeles are also participating Read more…
June 23 — FORTH and KALEAO announced today the creation of the KALEAO’s Heraklion development centre that officially seals their on-going collaboration towards a joint research lab on low power computing and shows a clear indication of the growing international high-tech involvement in Crete, Greece. The centre is going to be inaugurated on the 30th of Read more…
Hewlett Packard Enterprise (HPE), now about eight months into its transition as a separate entity, retained the prestige of fielding the most systems of any vendor on the Top500 list announced at the ISC2016. HPE had 127 systems (25.4 percent) though the number was down from 155 just six months ago. Other ISC news included Read more…
NVIDIA seems to be mounting a vigorous effort to dethrone the CPU as the leader of the processor pack for HPC and demanding datacenter workloads. That’s a tall order. Introduction at ISC 2016 of a PCIe-based version of is new Tesla P100 card is one element in the strategy. It should ease the upgrade path Read more…
SC15 was sort of a muted launch party for OpenHPC – the nascent effort to develop a ‘plug-and-play’ software framework for HPC. There seemed to be widespread agreement the idea had merit, not a lot of knowledge of details, and some wariness because Intel was a founding member and vocal advocate. Next week, ISC16 will mark the next milestone for OpenHPC, which has since grown into a full-fledged Linux Foundation Collaborative Project and today released version 1.0.1 of OpenHPC (build and test tools).
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