Today's Top Feature

Bill Gropp – Pursuing the Next Big Thing at NCSA

About eight months ago Bill Gropp was elevated to acting director of the National

By John Russell

Center Stage

HPC Compiler Company PathScale Seeks Life Raft

HPCwire has learned that HPC compiler company PathScale has fallen on difficult

By Tiffany Trader

Quantum Bits: D-Wave and VW; Google Quantum Lab; IBM Expands Access

For a technology that’s usually characterized as far off and in a distant galaxy,

By John Russell

Trump Budget Targets NIH, DOE, and EPA; No Mention of NSF

President Trump’s proposed U.S. fiscal 2018 budget issued today sharply cuts science spending while

By John Russell

People to Watch 2017

With 2017 underway, we’re looking to the future of high performance computing and the milestones that are growing ever closer.

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Swiss Researchers Peer Inside Chips with Improved X-Ray Imaging

March 22, 2017

Peering inside semiconductor chips using x-ray imaging isn’t new, but the technique hasn’t been especially good or easy to accomplish. Read more…

By John Russell

Intel Ships Drives Based on 3D XPoint Non-volatile Memory

March 20, 2017

Intel Corp. has begun shipping new storage drives based on its 3D XPoint non-volatile memory technology as it targets data-driven workloads. Intel’s new Optane solid-state drives, designated P4800X, seek to combine the attributes of memory and storage in the same device. Read more…

By George Leopold

US Supercomputing Leaders Tackle the China Question

March 15, 2017

Joint DOE-NSA report responds to the increased global pressures impacting the competitiveness of U.S. supercomputing. Read more…

By Tiffany Trader

HPC4Mfg Advances State-of-the-Art for American Manufacturing

March 9, 2017

Last Friday (March 3, 2017), the High Performance Computing for Manufacturing (HPC4Mfg) program held an industry engagement day workshop in San Diego, bringing together members of the US manufacturing community, national laboratories and universities to discuss the role of high-performance computing as an innovation engine for American manufacturing. Read more…

By Tiffany Trader

AMD Expands Exascale Vision at IEEE HPC Symposium

March 7, 2017

With the race towards exascale heating up – for example, the Exascale Computing Program PathForward awards are expected soon – AMD delivered more details of its exascale vision at last month’s 23rd IEEE Symposium on High Performance Computer Architecture. The chipmaker presented an “Exascale Node Architecture (ENA) as the primary building block for exascale machine” including descriptions of component, interconnect, and packaging strategy along with simulation benchmarks to bolster its case. Read more…

By John Russell

Intel Sets High Bar with Workforce Diversity Program Results

February 28, 2017

Intel’s impressive efforts to achieve workforce diversity and compensation equality edged up yet another notch last year according to the company’s 2016 Diversity and Inclusion Report released today. Read more…

By John Russell

Azure Edges AWS in Linpack Benchmark Study

February 15, 2017

The “when will clouds be ready for HPC” question has ebbed and flowed for years. Read more…

By John Russell

LBNL Develops Machine Learning Tool for Alloy Research

February 14, 2017

New and interesting uses for machine learning seem to arise daily. Researchers from Lawrence Berkeley National Laboratory recently trained an algorithm to predict structural characteristics of certain metal alloys that slashes computational power usually required for such calculations. Read more…

By John Russell

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