June 17, 2008
As AMD was unpacking its bags in Dresden yesterday, the company announced the next step in the evolution of its GPU-based application accelerator, the FireStream 9250. Read more…
June 17, 2008
UK-based ClearSpeed has launched its second-generation floating point accelerator lineup based on its new CSX700 “Callanish” ASIC. The new offerings include the e710 and e720 Advance boards and the CATS-700 1 teraflop server. Read more…
June 16, 2008
At ISC'08, NVIDIA has announced two new Tesla-branded GPU computing products, which incorporate the company's next generation 10-series processor that supports double precision floating point operations. Read more…
June 13, 2008
The 23rd annual International Supercomputing Conference (ISC) will bring together many of the world's leading experts in high performance computing this week in Dresden, Germany. HPCwire got an opportunity to ask conference chair Prof. Hans Meuer about the upcoming conference and his thoughts on the direction of supercomputing. Read more…
June 12, 2008
I'll be heading out to Dresden, Germany in a couple of days to attend the annual International Supercomputing Conference (ISC) and immerse myself in all things petascale. Read more…
June 9, 2008
Petaflop. Sure it's just a number, but it's a big number. On June 10, IBM announced that its Roadrunner supercomputer reached a record-breaking one petaflop -- a quadrillion floating point operations per second -- using the standard Linpack benchmark. It is the first general-purpose computer to reach this milestone. Read more…
Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC processing generate excessive heat which results in higher data center power consumption and additional data center costs.
Data centers traditionally use air cooling solutions including heatsinks and fans that may not be able to reduce energy consumption while maintaining infrastructure performance for AI and HPC workloads. Liquid cooled systems will be increasingly replacing air cooled solutions for data centers running HPC and AI workloads to meet heat and performance needs.
QCT worked with Intel to develop the QCT QoolRack, a rack-level direct-to-chip cooling solution which meets data center needs with impressive cooling power savings per rack over air cooled solutions, and reduces data centers’ carbon footprint with QCT QoolRack smart management.
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