The first numbers of the available bandwidth between chiplets is out – UCIe is estimating that chiplet packages could squeeze out communication speeds of 630Gbps, or 0.63Tbps, in a very tight a …
The folks at Intersect360 Research released their latest report and market update just ahead of ISC 2023, which was held in Hamburg, Germany, last week. The headline: “We’re returning to stab …
In the wake of SC22 last year, HPCwire wrote that “the conference’s eyes had shifted to carbon emissions and energy intensity” rather than the historical emphasis on flops-per-watt and powe …
May 25, 2023
ISC’s closing keynote this year was given jointly by a pair of distinguished HPC leaders, Thomas Sterling of Indiana University and Estela Suarez of Jülich S Read more…
May 25, 2023
As HPC and AI continue to rapidly advance, the alluring vision of nuclear fusion and its endless zero-carbon, low-radioactivity energy is the sparkle in many a Read more…
May 23, 2023
Jay Lofstead from Sandia National Laboratories and Jakob Luettgau from the University of Tennessee gave a highly audience interactive session on Ethics in AI an Read more…
May 23, 2023
MareNostrum 5, the next-generation supercomputer at the Barcelona Supercomputing Center (BSC) and one of EuroHPC’s flagship pre-exascale systems, has had a di Read more…
May 23, 2023
This year’s International Supercomputing Conference (ISC) kicked off yesterday in Hamburg, Germany, with a keynote from Dan Reed, presidential professor at th Read more…
May 23, 2023
Europe has clearly jumped into the global race to achieve practical quantum, though perhaps a step later (by a year or two) than the U.S. and China. Impressivel Read more…
May 22, 2023
Fresh off their third Top500 win for Frontier – now with an 8.4% higher Linpack score – the HPC team at Oak Ridge National Laboratory had some exciting news to share today. Frontier has passed its acceptance and is taking on grand scientific challenges. “Acceptance of Frontier took place at the... Read more…
May 22, 2023
Intel has finally provided specific details on wholesale changes it has made to its supercomputing chip roadmap after an abrupt reversal of an ambitious plan to Read more…
May 22, 2023
It’s not quite homeostasis, but it's close. There was little movement in the latest Top500, released today from the International Supercomputing Conference (I Read more…
May 21, 2023
Nvidia is ramping up deployment of its Superchips – amalgamated chips that include either two CPUs (the Grace CPU Superchip) or a CPU and a GPU (the Grace Hop Read more…
May 21, 2023
At ISC this week, Nvidia announced plans for a new hybrid classical-quantum computing lab with partners Jülich Supercomputing Centre and ParTec. The new lab is Read more…
May 19, 2023
The selection of Jack Dongarra as the recipient of the 2021 Turing Award was a well-deserved recognition of his invaluable contributions to the field of high pe Read more…
May 1, 2023
Following the EuroHPC Summit conference in Gothenburg, Sweden, last month, HPCwire asked Steve Conway, senior analyst at Intersect360 Research, to interview And Read more…
Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC processing generate excessive heat which results in higher data center power consumption and additional data center costs.
Data centers traditionally use air cooling solutions including heatsinks and fans that may not be able to reduce energy consumption while maintaining infrastructure performance for AI and HPC workloads. Liquid cooled systems will be increasingly replacing air cooled solutions for data centers running HPC and AI workloads to meet heat and performance needs.
QCT worked with Intel to develop the QCT QoolRack, a rack-level direct-to-chip cooling solution which meets data center needs with impressive cooling power savings per rack over air cooled solutions, and reduces data centers’ carbon footprint with QCT QoolRack smart management.
© 2023 HPCwire. All Rights Reserved. A Tabor Communications Publication
HPCwire is a registered trademark of Tabor Communications, Inc. Use of this site is governed by our Terms of Use and Privacy Policy.
Reproduction in whole or in part in any form or medium without express written permission of Tabor Communications, Inc. is prohibited.