Datanami
EnterpriseAI
HPCwire Japan
QCwire
HPC & AI Wall Street
For the First Time, UCIe Shares Bandwidth Speeds Between Chiplets
The first numbers of the available bandwidth between chiplets is out – UCIe is estimating that chiplet packages could squeeze out communication speeds of 630Gbps, or 0.63Tbps, in a very tight a …
Intersect360: HPC Market ‘Returning to Stable Growth’
The folks at Intersect360 Research released their latest report and market update just ahead of ISC 2023, which was held in Hamburg, Germany, last week. The headline: “We’re returning to stab …
At ISC, Sustainable Computing Leaders Discuss HPC’s Energy Crossroads
In the wake of SC22 last year, HPCwire wrote that “the conference’s eyes had shifted to carbon emissions and energy intensity” rather than the historical emphasis on flops-per-watt and powe …
Closing ISC Keynote by Sterling and Suarez Looks Backward and Forward
May 25, 2023
ISC’s closing keynote this year was given jointly by a pair of distinguished HPC leaders, Thomas Sterling of Indiana University and Estela Suarez of Jülich S Read more…
The Grand Challenge of Simulating Nuclear Fusion: An Overview with UKAEA’s Rob Akers
May 25, 2023
As HPC and AI continue to rapidly advance, the alluring vision of nuclear fusion and its endless zero-carbon, low-radioactivity energy is the sparkle in many a Read more…
ISC Session Explores Ethics in AI and HPC in the Era of LLMs
May 23, 2023
Jay Lofstead from Sandia National Laboratories and Jakob Luettgau from the University of Tennessee gave a highly audience interactive session on Ethics in AI an Read more…
MareNostrum 5 Hits Speed Bumps; Iconic Chapel to Host Quantum Systems
May 23, 2023
MareNostrum 5, the next-generation supercomputer at the Barcelona Supercomputing Center (BSC) and one of EuroHPC’s flagship pre-exascale systems, has had a di Read more…
ISC Keynote: To Reinvent HPC After Moore’s Law, Follow the Money
May 23, 2023
This year’s International Supercomputing Conference (ISC) kicked off yesterday in Hamburg, Germany, with a keynote from Dan Reed, presidential professor at th Read more…
ISC BOF: Euro Quantum Community Tackles HPC-QC Integration, Broad User Access
May 23, 2023
Europe has clearly jumped into the global race to achieve practical quantum, though perhaps a step later (by a year or two) than the U.S. and China. Impressivel Read more…
Exascale Frontier Supercomputer Has Passed Formal Acceptance: What That Means
May 22, 2023
Fresh off their third Top500 win for Frontier – now with an 8.4% higher Linpack score – the HPC team at Oak Ridge National Laboratory had some exciting news to share today. Frontier has passed its acceptance and is taking on grand scientific challenges. “Acceptance of Frontier took place at the... Read more…
Intel Admits GPU Mistakes, Reveals New Supercomputing Chip Roadmap
May 22, 2023
Intel has finally provided specific details on wholesale changes it has made to its supercomputing chip roadmap after an abrupt reversal of an ambitious plan to Read more…
Top500: Frontier Gains 92 Petaflops; Henri Gets a Little Greener
May 22, 2023
It’s not quite homeostasis, but it's close. There was little movement in the latest Top500, released today from the International Supercomputing Conference (I Read more…
Nvidia, HPE Announce Superchip-Powered ‘Isambard 3’ Supercomputer
May 21, 2023
Nvidia is ramping up deployment of its Superchips – amalgamated chips that include either two CPUs (the Grace CPU Superchip) or a CPU and a GPU (the Grace Hop Read more…
Nvidia Announces Hybrid Classical-Quantum Lab at Jülich SC; Touts Rolls Royce Quantum Simulation
May 21, 2023
At ISC this week, Nvidia announced plans for a new hybrid classical-quantum computing lab with partners Jülich Supercomputing Centre and ParTec. The new lab is Read more…
Turing Award Winner Jack Dongarra Reflects on Career Ahead of ISC
May 19, 2023
The selection of Jack Dongarra as the recipient of the 2021 Turing Award was a well-deserved recognition of his invaluable contributions to the field of high pe Read more…
EuroHPC Executive Director Talks Europe’s Supercomputing Future
May 1, 2023
Following the EuroHPC Summit conference in Gothenburg, Sweden, last month, HPCwire asked Steve Conway, senior analyst at Intersect360 Research, to interview And Read more…
Off the Wire from ISC23
With Software From Eviden and Pasqal, Jülich, GENCI and CEA Prepare Europe for the Quantum Era - (05/24/2023)
Latest Top500 List Highlights World’s Fastest and Most Energy Efficient Supercomputers are Powered by AMD - (05/23/2023)
Intel Launches Agilex 7 FPGAs with R-Tile, First FPGA with PCIe 5.0 and CXL Capabilities - (05/22/2023)
Supermicro Launches Industry’s 1st NVIDIA HGX H100 8 and 4-GPU H100 Servers with Liquid Cooling - (05/22/2023)
HPE Selected by Tokyo Tech to Build TSUBAME4.0 Supercomputer - (05/19/2023)
HPC-AI Market Returns to Pre-Pandemic Growth Rates, According to Intersect360 Research - (05/18/2023)
Torsten Hoefler Earns First Jack Dongarra Early Career Award - (04/17/2023)
With Software From Eviden and Pasqal, Jülich, GENCI and CEA Prepare Europe for the Quantum Era - (05/24/2023)
Latest Top500 List Highlights World’s Fastest and Most Energy Efficient Supercomputers are Powered by AMD - (05/23/2023)
Intel Launches Agilex 7 FPGAs with R-Tile, First FPGA with PCIe 5.0 and CXL Capabilities - (05/22/2023)
Supermicro Launches Industry’s 1st NVIDIA HGX H100 8 and 4-GPU H100 Servers with Liquid Cooling - (05/22/2023)
HPE Selected by Tokyo Tech to Build TSUBAME4.0 Supercomputer - (05/19/2023)
HPC-AI Market Returns to Pre-Pandemic Growth Rates, According to Intersect360 Research - (05/18/2023)
Torsten Hoefler Earns First Jack Dongarra Early Career Award - (04/17/2023)
Leading Solution Providers
ISC 2023 Booth Videos
 |
 |
 |
 |
 |
 |
Whitepaper
QCT QoolRack: An Optimized Liquid Cooling Solution for HPC/AI Workloads
Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC processing generate excessive heat which results in higher data center power consumption and additional data center costs.
Data centers traditionally use air cooling solutions including heatsinks and fans that may not be able to reduce energy consumption while maintaining infrastructure performance for AI and HPC workloads. Liquid cooled systems will be increasingly replacing air cooled solutions for data centers running HPC and AI workloads to meet heat and performance needs.
QCT worked with Intel to develop the QCT QoolRack, a rack-level direct-to-chip cooling solution which meets data center needs with impressive cooling power savings per rack over air cooled solutions, and reduces data centers’ carbon footprint with QCT QoolRack smart management.
Download Now
Sponsored by QCT
Advanced Scale Career Development & Workforce Enhancement Center
Featured Advanced Scale Jobs:
HPCwire Resource Library
-
Whitepaper: Streamlining AI Data Management
-
Whitepaper: Reducing Bias and Increasing Accuracy in AI Models
-
Whitepaper: A New Standard in CAE Solutions for Manufacturing
HPCwire Product Showcase
© 2023 HPCwire. All Rights Reserved. A Tabor Communications Publication
HPCwire is a registered trademark of Tabor Communications, Inc. Use of this site is governed by our Terms of Use and Privacy Policy.
Reproduction in whole or in part in any form or medium without express written permission of Tabor Communications, Inc. is prohibited.