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Stanford Group Creates Four-Layer Stacked Chip
December 18, 2014
With transistor scaling slated to come up against some fundamental limits over the next five to seven years, chip designers are hot on the trail of technologies Read more…
New Research Advances Heterogenous 3D Chip Design
February 6, 2014
As transistors approach the limits of miniaturization, the rapid pace of progress in the microprocessor industry is destined to start declining unless researche Read more…
HP Scientists Envision 10-Teraflop Manycore Chip
March 15, 2012
In high performance computing, Hewlett-Packard is best known for supplying bread-and-butter HPC systems, built with standard processors and interconnects. But the company's research arm has been devising a manycore chipset, which would outrun the average-sized HPC cluster of today. The design represents a radical leap in performance, and if implemented, would fulfill the promise of exascale computing. Read more…
The Weekly Top Five
May 5, 2011
The Weekly Top Five features the five biggest HPC stories of the week, condensed for your reading pleasure. This week, we cover ISRO's newest supercomputer; Tokyo Tech's selection of EM Photonics' CULA library; Intel's 3-D transistor breakthrough; the latest LSF Tools from Platform Computing; and SciNet's new NextIO GPU-based system. Read more…
3D Chip Technology Readies for Take Off
March 14, 2011
Three-dimensional chip stacking beings path to commercialization. Read more…
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