Datanami
EnterpriseAI
HPCwire Japan
QCwire
HPC & AI Wall Street
IBM, Tokyo Electron Announce 3D Chip Stacking Breakthrough
July 7, 2022
The battle against the slowing of Moore’s law continues. The latest front: 3D chip stacking, which has seen high-profile efforts from several companies as the Read more…
Stanford Group Creates Four-Layer Stacked Chip
December 18, 2014
With transistor scaling slated to come up against some fundamental limits over the next five to seven years, chip designers are hot on the trail of technologies Read more…
New Research Advances Heterogenous 3D Chip Design
February 6, 2014
As transistors approach the limits of miniaturization, the rapid pace of progress in the microprocessor industry is destined to start declining unless researche Read more…
HP Scientists Envision 10-Teraflop Manycore Chip
March 15, 2012
In high performance computing, Hewlett-Packard is best known for supplying bread-and-butter HPC systems, built with standard processors and interconnects. But the company's research arm has been devising a manycore chipset, which would outrun the average-sized HPC cluster of today. The design represents a radical leap in performance, and if implemented, would fulfill the promise of exascale computing. Read more…
The Weekly Top Five – 05/05/2011
May 5, 2011
The Weekly Top Five features the five biggest HPC stories of the week, condensed for your reading pleasure. This week, we cover ISRO's newest supercomputer; Tokyo Tech's selection of EM Photonics' CULA library; Intel's 3-D transistor breakthrough; the latest LSF Tools from Platform Computing; and SciNet's new NextIO GPU-based system. Read more…
3D Chip Technology Readies for Take Off
March 14, 2011
Three-dimensional chip stacking beings path to commercialization. Read more…
- Click Here for More Headlines
Leading Solution Providers
SC22 Booth Videos
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
Whitepaper
A New Standard in CAE Solutions for Manufacturing
Today, manufacturers of all sizes face many challenges. Not only do they need to deliver complex products quickly, they must do so with limited resources while continuously innovating and improving product quality. With the use of computer-aided engineering (CAE), engineers can design and test ideas for new products without having to physically build many expensive prototypes. This helps lower costs, enhance productivity, improve quality, and reduce time to market.
As the scale and scope of CAE grows, manufacturers need reliable partners with deep HPC and manufacturing expertise. Together with AMD, HPE provides a comprehensive portfolio of high performance systems and software, high value services, and an outstanding ecosystem of performance optimized CAE applications to help manufacturing customers reduce costs and improve quality, productivity, and time to market.
Read this whitepaper to learn how HPE and AMD set a new standard in CAE solutions for manufacturing and can help your organization optimize performance.
Download Now
Sponsored by HPE
Whitepaper
Porting CUDA Applications to Run on AMD GPUs
A workload-driven system capable of running HPC/AI workloads is more important than ever. Organizations face many challenges when building a system capable of running HPC and AI workloads. There are also many complexities in system design and integration. Building a workload driven solution requires expertise and domain knowledge that organizational staff may not possess.
This paper describes how Quanta Cloud Technology (QCT), a long-time Intel® partner, developed the Taiwania 2 and Taiwania 3 supercomputers to meet the research needs of the Taiwan’s academic, industrial, and enterprise users. The Taiwan National Center for High-Performance Computing (NCHC) selected QCT for their expertise in building HPC/AI supercomputers and providing worldwide end-to-end support for solutions from system design, through integration, benchmarking and installation for end users and system integrators to ensure customer success.
Download Now
Sponsored by AMD
Advanced Scale Career Development & Workforce Enhancement Center
Featured Advanced Scale Jobs:
HPCwire Resource Library
-
Webcasts and webinars: Leveraging Exascale Era Technology for Advanced Computer-Aided Engineering
-
Whitepaper: Data Center File System
-
Whitepaper: 2021 Storage Technology Series
HPCwire Product Showcase
© 2023 HPCwire. All Rights Reserved. A Tabor Communications Publication
HPCwire is a registered trademark of Tabor Communications, Inc. Use of this site is governed by our Terms of Use and Privacy Policy.
Reproduction in whole or in part in any form or medium without express written permission of Tabor Communications, Inc. is prohibited.