IBM, Tokyo Electron Announce 3D Chip Stacking Breakthrough

July 7, 2022

The battle against the slowing of Moore’s law continues. The latest front: 3D chip stacking, which has seen high-profile efforts from several companies as the Read more…

Stanford Group Creates Four-Layer Stacked Chip

December 18, 2014

With transistor scaling slated to come up against some fundamental limits over the next five to seven years, chip designers are hot on the trail of technologies Read more…

New Research Advances Heterogenous 3D Chip Design

February 6, 2014

As transistors approach the limits of miniaturization, the rapid pace of progress in the microprocessor industry is destined to start declining unless researche Read more…

HP Scientists Envision 10-Teraflop Manycore Chip

March 15, 2012

In high performance computing, Hewlett-Packard is best known for supplying bread-and-butter HPC systems, built with standard processors and interconnects. But the company's research arm has been devising a manycore chipset, which would outrun the average-sized HPC cluster of today. The design represents a radical leap in performance, and if implemented, would fulfill the promise of exascale computing. Read more…

The Weekly Top Five – 05/05/2011

May 5, 2011

The Weekly Top Five features the five biggest HPC stories of the week, condensed for your reading pleasure. This week, we cover ISRO's newest supercomputer; Tokyo Tech's selection of EM Photonics' CULA library; Intel's 3-D transistor breakthrough; the latest LSF Tools from Platform Computing; and SciNet's new NextIO GPU-based system. Read more…

3D Chip Technology Readies for Take Off

March 14, 2011

Three-dimensional chip stacking beings path to commercialization. Read more…

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Whitepaper

A New Standard in CAE Solutions for Manufacturing

Today, manufacturers of all sizes face many challenges. Not only do they need to deliver complex products quickly, they must do so with limited resources while continuously innovating and improving product quality. With the use of computer-aided engineering (CAE), engineers can design and test ideas for new products without having to physically build many expensive prototypes. This helps lower costs, enhance productivity, improve quality, and reduce time to market.

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Whitepaper

Porting CUDA Applications to Run on AMD GPUs

A workload-driven system capable of running HPC/AI workloads is more important than ever. Organizations face many challenges when building a system capable of running HPC and AI workloads. There are also many complexities in system design and integration. Building a workload driven solution requires expertise and domain knowledge that organizational staff may not possess.

This paper describes how Quanta Cloud Technology (QCT), a long-time Intel® partner, developed the Taiwania 2 and Taiwania 3 supercomputers to meet the research needs of the Taiwan’s academic, industrial, and enterprise users. The Taiwan National Center for High-Performance Computing (NCHC) selected QCT for their expertise in building HPC/AI supercomputers and providing worldwide end-to-end support for solutions from system design, through integration, benchmarking and installation for end users and system integrators to ensure customer success.

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