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Tackling Power and Resilience at Exascale
July 21, 2015
Although the utility of FLOPS-driven benchmarks can make for interesting debate, the fact remains that major supercomputing milestones, like 1,000X performance Read more…
DOE Research Group Makes Case for Exascale
February 21, 2011
Exascale computing promises incredible science breakthroughs, but it won't come easily, and it won't come free. Read more…
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Whitepaper
QCT QoolRack: An Optimized Liquid Cooling Solution for HPC/AI Workloads
Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC processing generate excessive heat which results in higher data center power consumption and additional data center costs.
Data centers traditionally use air cooling solutions including heatsinks and fans that may not be able to reduce energy consumption while maintaining infrastructure performance for AI and HPC workloads. Liquid cooled systems will be increasingly replacing air cooled solutions for data centers running HPC and AI workloads to meet heat and performance needs.
QCT worked with Intel to develop the QCT QoolRack, a rack-level direct-to-chip cooling solution which meets data center needs with impressive cooling power savings per rack over air cooled solutions, and reduces data centers’ carbon footprint with QCT QoolRack smart management.
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