April 22, 2023
Esperanto Technologies is working to accelerate software support for its novel, high-performance AI chips. The company has ported a large-language model (LLM) f Read more…
April 6, 2023
A new scientific paper from Google details the performance of its Cloud TPU v4 supercomputing platform, claiming it provides exascale performance for machine le Read more…
January 25, 2022
In a market still filling with fledging silicon chips, Ceremorphic, Inc. has exited stealth and is telling the world about what it calls its patented new ThreadArch multi-thread processor technology that is intended to help improve new supercomputers. Venkat Mattela, the company’s founder and CEO of Ceremorphic, calls his latest chip design... Read more…
September 27, 2021
Making sense of ML performance and benchmark data is an ongoing challenge. In light of last week’s release of the most recent MLPerf (v1.1) inference results, now is perhaps a good time to review how valuable (or not) such ML benchmarks are and the challenges they face. Two researchers... Read more…
August 23, 2021
In a major refresh of its Z Series chips, IBM is adding on-chip AI acceleration capabilities to allow enterprise customers to perform deep learning inferencing Read more…
August 18, 2021
The latest version of Baidu’s open AI platform, Baidu Brain 7.0, has been launched by the Chinese technology company, which also announced that its Kunlun II Read more…
July 21, 2021
Early use of Cerebras’ CS-1 server and wafer-scale engine (WSE) has demonstrated promising acceleration of machine-learning algorithms, according to participa Read more…
September 30, 2020
The 2020 AI Hardware Summit kicked off yesterday with long-time computer luminary David Patterson digging into all things TPU and extolling on how they outrun G Read more…
As Federal agencies navigate an increasingly complex and data-driven world, learning how to get the most out of high-performance computing (HPC), artificial intelligence (AI), and machine learning (ML) technologies is imperative to their mission. These technologies can significantly improve efficiency and effectiveness and drive innovation to serve citizens' needs better. Implementing HPC and AI solutions in government can bring challenges and pain points like fragmented datasets, computational hurdles when training ML models, and ethical implications of AI-driven decision-making. Still, CTG Federal, Dell Technologies, and NVIDIA unite to unlock new possibilities and seamlessly integrate HPC capabilities into existing enterprise architectures. This integration empowers organizations to glean actionable insights, improve decision-making, and gain a competitive edge across various domains, from supply chain optimization to financial modeling and beyond.
Data centers are experiencing increasing power consumption, space constraints and cooling demands due to the unprecedented computing power required by today’s chips and servers. HVAC cooling systems consume approximately 40% of a data center’s electricity. These systems traditionally use air conditioning, air handling and fans to cool the data center facility and IT equipment, ultimately resulting in high energy consumption and high carbon emissions. Data centers are moving to direct liquid cooled (DLC) systems to improve cooling efficiency thus lowering their PUE, operating expenses (OPEX) and carbon footprint.
This paper describes how CoolIT Systems (CoolIT) meets the need for improved energy efficiency in data centers and includes case studies that show how CoolIT’s DLC solutions improve energy efficiency, increase rack density, lower OPEX, and enable sustainability programs. CoolIT is the global market and innovation leader in scalable DLC solutions for the world’s most demanding computing environments. CoolIT’s end-to-end solutions meet the rising demand in cooling and the rising demand for energy efficiency.
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