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AMD Shows Off MI300 Chip for the First Time
January 5, 2023
At the tail end of AMD’s 75-minute CES keynote, held yesterday in Las Vegas and via livestream, CEO Lisa Su shared new details of the forthcoming MI300 chip and publicly unveiled the silicon. The MI300 (teased earlier this year) is the first to combine a CPU, GPU and memory into a single integrated design, incorporating nine 5nm chiplets that are 3D stacked on top of four 6nm chiplets with 128 gigabytes of HBM3 memory. Read more…
From Exasperation to Exascale: HPE’s Nic Dubé on Frontier’s Untold Story
December 2, 2022
The Frontier supercomputer – still fresh off its chart-topping 1.1 Linpack exaflops run and maintaining its number-one spot on the Top500 list – was still v Read more…
Europe’s Chip Sovereignty Altering US Chip Companies’ Exascale Approach
November 16, 2022
Europe’s sovereign approach to exascale computing is complicating plans for U.S. chipmakers to breakthrough in the market, and in the process, empowering local chipmakers. For one, a European chip startup called SiPearl is emerging as an early... Read more…
Cerebras Builds ‘Exascale’ AI Supercomputer
November 14, 2022
Cerebras is putting down stakes to be a player in the AI cloud computing with a supercomputer called Andromeda, which achieves over an exaflops of "AI performan Read more…
AMD Thrives in Servers amid Intel Restructuring, Layoffs
November 12, 2022
Chipmakers regularly indulge in a game of brinkmanship, with an example being Intel and AMD trying to upstage one another with server chip launches this week. But each of those companies are in different positions, with AMD playing its traditional role of a scrappy underdog trying to unseat the behemoth Intel... Read more…
AMD’s Genoa CPUs Offer Up to 96 5nm Cores Across 12 Chiplets
November 10, 2022
AMD’s fourth-generation Epyc processor line has arrived, starting with the “general-purpose” architecture, called “Genoa,” the successor to third-gen Eypc Milan, which debuted in March of last year. At a launch event held today in San Francisco, AMD announced the general availability of the latest Epyc CPUs with up to 96 TSMC 5nm Zen 4 cores... Read more…
HPE Adapting New Server Hardware to Changing Cloud Models
November 1, 2022
Server hardware has taken a backseat to software-defined virtual machines handling datacenter workloads, but HPE is emphasizing the importance of hardware in these virtual operating models. HPE created waves when it released the next-generation ProLiant Gen11 servers with a flagship server based on Arm CPUs, which sent a strong... Read more…
Dell, AMD, IBM, and Strangeworks Dig into Quantum’s Future
October 27, 2022
What’s the quantum computing fuss all about? Should you jump into the game or run as fast as you can away from it? A fascinating panel with committed quantum players, IBM and Strangeworks, and traditional computing powerhouses, Dell (systems) and AMD (chips), tackled this topic at the HPC + AI on Wall Street conference held earlier this... Read more…
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Whitepaper
A New Standard in CAE Solutions for Manufacturing
Today, manufacturers of all sizes face many challenges. Not only do they need to deliver complex products quickly, they must do so with limited resources while continuously innovating and improving product quality. With the use of computer-aided engineering (CAE), engineers can design and test ideas for new products without having to physically build many expensive prototypes. This helps lower costs, enhance productivity, improve quality, and reduce time to market.
As the scale and scope of CAE grows, manufacturers need reliable partners with deep HPC and manufacturing expertise. Together with AMD, HPE provides a comprehensive portfolio of high performance systems and software, high value services, and an outstanding ecosystem of performance optimized CAE applications to help manufacturing customers reduce costs and improve quality, productivity, and time to market.
Read this whitepaper to learn how HPE and AMD set a new standard in CAE solutions for manufacturing and can help your organization optimize performance.
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Sponsored by HPE
Whitepaper
Porting CUDA Applications to Run on AMD GPUs
A workload-driven system capable of running HPC/AI workloads is more important than ever. Organizations face many challenges when building a system capable of running HPC and AI workloads. There are also many complexities in system design and integration. Building a workload driven solution requires expertise and domain knowledge that organizational staff may not possess.
This paper describes how Quanta Cloud Technology (QCT), a long-time Intel® partner, developed the Taiwania 2 and Taiwania 3 supercomputers to meet the research needs of the Taiwan’s academic, industrial, and enterprise users. The Taiwan National Center for High-Performance Computing (NCHC) selected QCT for their expertise in building HPC/AI supercomputers and providing worldwide end-to-end support for solutions from system design, through integration, benchmarking and installation for end users and system integrators to ensure customer success.
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Sponsored by AMD
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