Optical I/O Technology Needed for Zettascale, Say Top Chipmakers

March 16, 2023

Optical I/O is being singled out by top companies to push computing beyond exascale and into zettascale. The technology was singled out in a recent speech by AM Read more…

Broadcom CTO: Moore’s Law Blowout Sale Almost Over

December 6, 2013

Another computing expert has weighed in on Moore's Law predicted demise. Speaking at a press roundtable on Wednesday in San Francisco, Henry Samueli, co-founder Read more…

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Whitepaper

QCT QoolRack: An Optimized Liquid Cooling Solution for HPC/AI Workloads

Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC processing generate excessive heat which results in higher data center power consumption and additional data center costs.

Data centers traditionally use air cooling solutions including heatsinks and fans that may not be able to reduce energy consumption while maintaining infrastructure performance for AI and HPC workloads. Liquid cooled systems will be increasingly replacing air cooled solutions for data centers running HPC and AI workloads to meet heat and performance needs.

QCT worked with Intel to develop the QCT QoolRack, a rack-level direct-to-chip cooling solution which meets data center needs with impressive cooling power savings per rack over air cooled solutions, and reduces data centers’ carbon footprint with QCT QoolRack smart management.

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