May 23, 2023
MareNostrum 5, the next-generation supercomputer at the Barcelona Supercomputing Center (BSC) and one of EuroHPC’s flagship pre-exascale systems, has had a di Read more…
December 16, 2022
The European Union will release €270 million in funds as it tries to attain technology independence by building chips based on the open RISC-V instruction set Read more…
November 18, 2022
One of the original RISC-V designers this week boldly predicted that the open architecture will surpass rival chip architectures in performance. "The prediction is two or three years we'll be surpassing your architectures and available performance with... Read more…
June 16, 2022
The long-troubled, hotly anticipated MareNostrum 5 supercomputer finally has a vendor: Atos, which will be supplying a system that includes both Nvidia and Inte Read more…
March 16, 2022
Intel has announced that it is making an “initial” €33 billion (~$36 billion) investment across the semiconductor value chain in Europe. The investment — which spans R&D, manufacturing and packaging — comes at a time when sovereignty is, more than ever, a headline priority for the continent. What was announced? A “Silicon Junction” in Germany with two new fabs... Read more…
February 3, 2022
Just about a month ago, Pfizer scored its second huge win of the pandemic when the U.S. Food and Drug Administration issued another emergency use authorization Read more…
December 21, 2021
Call it a New Year’s resolution: the EuroHPC Joint Undertaking—which serves as the concerted supercomputing play of the European Union—has issued a new ca Read more…
June 28, 2021
Last October, the executive director of the EuroHPC JU – Anders Dam Jensen – said that with respect to MareNostrum 5 (the final pre-exascale EuroHPC system), “the tendering process was in its very final phase” and that “there would be announcements on that in the coming weeks.” Eight months later, the system’s status is still set to “it’s complicated.” Now, thanks to a brief presentation from... Read more…
Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC processing generate excessive heat which results in higher data center power consumption and additional data center costs.
Data centers traditionally use air cooling solutions including heatsinks and fans that may not be able to reduce energy consumption while maintaining infrastructure performance for AI and HPC workloads. Liquid cooled systems will be increasingly replacing air cooled solutions for data centers running HPC and AI workloads to meet heat and performance needs.
QCT worked with Intel to develop the QCT QoolRack, a rack-level direct-to-chip cooling solution which meets data center needs with impressive cooling power savings per rack over air cooled solutions, and reduces data centers’ carbon footprint with QCT QoolRack smart management.
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