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Intel Says UCIe to Outpace PCIe in Speed Race

May 11, 2022

Intel has shared more details on a new interconnect that is the foundation of the company’s long-term plan for x86, Arm and RISC-V architectures to co-exist in a single chip package. The semiconductor company is taking a modular approach to chip design with the option for customers to cram computing blocks such as CPUs, GPUs and AI accelerators inside a single chip package. Read more…

AMD Milan-X CPU with 3D V-Cache Available in Four SKUs, Up to 64-Cores

March 21, 2022

Following their debut launch in November, AMD Epyc processors with 3D V-Cache technology, codenamed Milan-X, are now generally available from major system-makers as well as from cloud provider Microsoft Azure. Available in four SKUs and ranging from 16- to  64-cores, the new processors feature 768 megabytes of L3 cache... Read more…

Industry Consortium Forms to Drive UCIe Chiplet Interconnect Standard

March 2, 2022

A new industry consortium aims to establish a die-to-die interconnect standard – Universal Chiplet Interconnect Express (UCIe) – in support of an open chipl Read more…

AMD Launches Milan-X CPU with 3D V-Cache and Multichip Instinct MI200 GPU

November 8, 2021

At a virtual event this morning, AMD CEO Lisa Su unveiled the company’s latest and much-anticipated server products: the new Milan-X CPU, which leverages AMD’s new 3D V-Cache technology; and its new Instinct MI200 GPU, which provides up to 220 compute units across two Infinity Fabric-connected dies, delivering an astounding 47.9 peak double-precision teraflops. “We're in a high-performance... Read more…

UCLA Researchers Report Largest Chiplet Design and Early Prototyping

October 12, 2021

What’s the best path forward for large-scale chip/system integration? Good question. Cerebras has set a high bar with its wafer scale engine 2 (WSE-2); it has 2.6 trillion transistors, including 850,000 cores, and was fabricated using TSMC’s 7nm process on a roughly 8” x 8” silicon footprint. Read more…

AMD Files Patent on New GPU Chiplet Approach

January 5, 2021

Advanced Micro Devices is accelerating the GPU chiplet race with the release of a U.S. patent application for a device that incorporates high-bandwidth intercon Read more…

Chiplet Effort Advances for Workload Acceleration

September 27, 2019

Chiplet-based designs, so called because they combine multiple components into a single package, are increasingly seen as addressing the inability of general-pu Read more…

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