December 7, 2023
AMD and Nvidia are locked in an AI performance battle – much like the gaming GPU performance clash the companies have waged for decades. AMD has claimed it Read more…
October 19, 2023
It is safe to say that ARM isn't a scrappy startup that was once the pride of the UK. The US-based IPO made the chip designer a big-game chip player, and the Read more…
June 14, 2023
Swap out a few silicon parts, and voila, you have a spanking new chip that did not take much work to design. That is how AMD's CEO, Lisa Su described the company making of its new MI300X GPU and its 128-core Epyc chip code-named Bergamo, which is targeted at dense server chips. Read more…
June 7, 2023
The first numbers of the available bandwidth between chiplets is out – UCIe is estimating that chiplet packages could squeeze out communication speeds of 630Gbps, or 0.63Tbps, in a very tight area. That number was shared by the Universal Chiplet Interconnect Express consortium last month... Read more…
March 16, 2023
Optical I/O is being singled out by top companies to push computing beyond exascale and into zettascale. The technology was singled out in a recent speech by AM Read more…
February 21, 2023
If a zettascale computer were assembled using today's supercomputing technologies, it would consume about 21 gigawatts, or equivalent to the energy produced by 21 nuclear power plants. The math was presented in a keynote speech by AMD CEO Lisa Su at the ISSCC trade show being held in San Francisco held this week. A zettaflop supercomputer would have the computing capability... Read more…
January 24, 2023
Intel's CEO Pat Gelsinger last week made a grand proclamation that chips will be for the next few decades what oil and gas was to the world over the last 50 years. While that remains to be seen, two technology associations are joining hands to develop building blocks to stabilize the development of future chip designs. The goal of the standard is to set the stage for a thriving marketplace that fuels... Read more…
December 13, 2022
The ability to spin up custom chip designs at a lower cost has made the RISC-V architecture attractive for devices that don't require cutting edge chips. Ventana Micro Systems is now bringing that ability to RISC-V chips for servers, with plans to release chips for high-performance computers in the future. Ventana said... Read more…
Making the Most of Today’s Cloud-First Approach to Running HPC and AI Workloads With Penguin Scyld Cloud Central™
Bursting to cloud has long been used to complement on-premises HPC capacity to meet variable compute demands. But in today’s age of cloud, many workloads start on the cloud with little IT or corporate oversight. What is needed is a way to operationalize the use of these cloud resources so that users get the compute power they need when they need it, but with constraints that take costs and the efficient use of existing compute power into account. Download this special report to learn more about this topic.
Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC processing generate excessive heat which results in higher data center power consumption and additional data center costs.
Data centers traditionally use air cooling solutions including heatsinks and fans that may not be able to reduce energy consumption while maintaining infrastructure performance for AI and HPC workloads. Liquid cooled systems will be increasingly replacing air cooled solutions for data centers running HPC and AI workloads to meet heat and performance needs.
QCT worked with Intel to develop the QCT QoolRack, a rack-level direct-to-chip cooling solution which meets data center needs with impressive cooling power savings per rack over air cooled solutions, and reduces data centers’ carbon footprint with QCT QoolRack smart management.
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