October 6, 2022
Intel is opening up its fabs for academic institutions so researchers can get their hands on physical versions of its chips, with the end goal of boosting semic Read more…
September 8, 2022
The wheels are turning on the so-called CHIPS and Science Act, with a flurry of activity this week to turn the legislation into action. On Friday, U.S. President Joe Biden will be in Ohio alongside Intel CEO Pat Gelsinger to break ground on the chipmaker's new $20 billion manufacturing site, which will likely be partially... Read more…
August 16, 2022
For the second time in as many weeks, President Biden has signed into law a major bill with significant implications for the computing sector. The Inflation Reduction Act – which is certainly the cornerstone of Biden’s first two years in office – allocates hundreds of billions of dollars toward energy security, climate change and healthcare. Among those hundreds of billions are hundreds of millions for scientific computing. At the signing ceremony... Read more…
August 9, 2022
Just a few days after it was passed in the Senate, the U.S. CHIPS and Science Act has been signed into law by President Biden. In a ceremony today, Biden signed and lauded the ambitious piece of legislation, which over the course of the legislative process broadened to include hundreds of billions in additional science and technology spending. He was flanked by Speaker... Read more…
August 3, 2022
After two-plus years of contentious debate, several different names, and final passage by the House (243-187) and Senate (64-33) last week, the Chips and Science Act will soon become law. Besides the $54.2 billion provided to boost US-based chip manufacturing, the act reshapes US science policy in meaningful ways. NSF’s proposed budget... Read more…
June 22, 2022
You may recall that efforts proposed in 2020 to remake the National Science Foundation (Endless Frontier Act) have since expanded and morphed into two gigantic bills, the America COMPETES Act in the U.S. House of Representatives and the U.S. Innovation and Competition Act in the U.S. Senate. So far, efforts to reconcile the two pieces of legislation have snagged and recent reports... Read more…
Today, manufacturers of all sizes face many challenges. Not only do they need to deliver complex products quickly, they must do so with limited resources while continuously innovating and improving product quality. With the use of computer-aided engineering (CAE), engineers can design and test ideas for new products without having to physically build many expensive prototypes. This helps lower costs, enhance productivity, improve quality, and reduce time to market.
As the scale and scope of CAE grows, manufacturers need reliable partners with deep HPC and manufacturing expertise. Together with AMD, HPE provides a comprehensive portfolio of high performance systems and software, high value services, and an outstanding ecosystem of performance optimized CAE applications to help manufacturing customers reduce costs and improve quality, productivity, and time to market.
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A workload-driven system capable of running HPC/AI workloads is more important than ever. Organizations face many challenges when building a system capable of running HPC and AI workloads. There are also many complexities in system design and integration. Building a workload driven solution requires expertise and domain knowledge that organizational staff may not possess.
This paper describes how Quanta Cloud Technology (QCT), a long-time Intel® partner, developed the Taiwania 2 and Taiwania 3 supercomputers to meet the research needs of the Taiwan’s academic, industrial, and enterprise users. The Taiwan National Center for High-Performance Computing (NCHC) selected QCT for their expertise in building HPC/AI supercomputers and providing worldwide end-to-end support for solutions from system design, through integration, benchmarking and installation for end users and system integrators to ensure customer success.
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