January 26, 2023
The future of the semiconductor industry was partially being decided last week by a mix of politicians, policy hawks and chip industry executives jockeying for Read more…
November 18, 2022
One of the original RISC-V designers this week boldly predicted that the open architecture will surpass rival chip architectures in performance. "The prediction is two or three years we'll be surpassing your architectures and available performance with... Read more…
October 6, 2022
Intel is opening up its fabs for academic institutions so researchers can get their hands on physical versions of its chips, with the end goal of boosting semic Read more…
September 29, 2022
Intel's engineering roots saw a revival at this week's Innovation, with attendees recalling the show’s resemblance to Intel Developer Forum, the company's ann Read more…
January 23, 2013
The Defense Advanced Research Projects Agency (DARPA) and the Semiconductor Research Corporation (SRC) have launched a new consortium to advance the pace of semiconductor innovation in the US as the technology approaches the limits of miniaturization. The main thrust of the project is the creation of the Semiconductor Technology Advanced Research Network, aka STARnet. Read more…
December 6, 2012
With the recent introduction of Intel's first Xeon Phi coprocessors, NVIDIA's latest Kepler GPUs, and AMD's new FirePro S10000 graphics cards, the competition for HPC chip componentry has entered a new phase. The three chipmakers have taken somewhat different paths, though, and it will be up to the market to decide which vendor's approach will win the day. Read more…
Today, manufacturers of all sizes face many challenges. Not only do they need to deliver complex products quickly, they must do so with limited resources while continuously innovating and improving product quality. With the use of computer-aided engineering (CAE), engineers can design and test ideas for new products without having to physically build many expensive prototypes. This helps lower costs, enhance productivity, improve quality, and reduce time to market.
As the scale and scope of CAE grows, manufacturers need reliable partners with deep HPC and manufacturing expertise. Together with AMD, HPE provides a comprehensive portfolio of high performance systems and software, high value services, and an outstanding ecosystem of performance optimized CAE applications to help manufacturing customers reduce costs and improve quality, productivity, and time to market.
Read this whitepaper to learn how HPE and AMD set a new standard in CAE solutions for manufacturing and can help your organization optimize performance.
A workload-driven system capable of running HPC/AI workloads is more important than ever. Organizations face many challenges when building a system capable of running HPC and AI workloads. There are also many complexities in system design and integration. Building a workload driven solution requires expertise and domain knowledge that organizational staff may not possess.
This paper describes how Quanta Cloud Technology (QCT), a long-time Intel® partner, developed the Taiwania 2 and Taiwania 3 supercomputers to meet the research needs of the Taiwan’s academic, industrial, and enterprise users. The Taiwan National Center for High-Performance Computing (NCHC) selected QCT for their expertise in building HPC/AI supercomputers and providing worldwide end-to-end support for solutions from system design, through integration, benchmarking and installation for end users and system integrators to ensure customer success.
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