Tag: chips
<img style=”float: left;” src=”http://media2.hpcwire.com/hpcwire/STARnet_logo_120x.jpg” alt=”” width=”94″ height=”116″ />The Defense Advanced Research Projects Agency (DARPA) and the Semiconductor Research Corporation (SRC) have launched a new consortium to advance the pace of semiconductor innovation in the US as the technology approaches the limits of miniaturization. The main thrust of the project is the creation of the Semiconductor Technology Advanced Research Network, aka STARnet.
<img style=”float: left;” src=”http://media2.hpcwire.com/hpcwire/Xeon_Phi_chip_small.jpg” alt=”” width=”96″ height=”79″ />With the recent introduction of Intel’s first Xeon Phi coprocessors, NVIDIA’s latest Kepler GPUs, and AMD’s new FirePro S10000 graphics cards, the competition for HPC chip componentry has entered a new phase. The three chipmakers have taken somewhat different paths, though, and it will be up to the market to decide which vendor’s approach will win the day.
Dell hands over its Calxeda ARM-based server platform to the Apache community.
Dell hands over its Calxeda ARM-based server platform to the Apache community.
Chip analyst evaluates efficiencies of latest processors.
According to HP, we are transitioning from the Information Age to the Insight Age, which signals a need for new architectures.
HP Labs announces advances in memristor technology; and 48-core Intel processors to enter limited production for academic institutions. We recap those stories and more in our weekly wrapup.
Chipmakers converged on San Francisco this week to talk up their newest semiconductor products at the International Solid State Circuits Conference (ISSCC). Of particular interest to the HPC crowd are Intel’s Westmere EP and “Tukwila” Itanium 9300, and IBM’s POWER7.
Intel will preview first 32nm Xeon chips on Monday.
First 32nm Xeons promise better performance and energy efficiency.
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