July 17, 2023
Editor’s note; Recently Google's Bard provided what it considered the Top 5 Trends in HPC for the First 6 Months of 2023 to HPCwire. While the answers Read more…
January 18, 2018
After five annual workshops on Big Data and Extreme-Scale Computing (BDEC), a group of international HPC heavyweights including Jack Dongarra (University of Te Read more…
March 8, 2016
These are exciting times for HPC. High-performance computing and its cousin high-productivity computing are expanding such that the previous definitions of HPC Read more…
October 14, 2008
Event-driven cloud computing is getting a lot of attention, but it's the underlying architecture that counts. Read more…
Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC processing generate excessive heat which results in higher data center power consumption and additional data center costs.
Data centers traditionally use air cooling solutions including heatsinks and fans that may not be able to reduce energy consumption while maintaining infrastructure performance for AI and HPC workloads. Liquid cooled systems will be increasingly replacing air cooled solutions for data centers running HPC and AI workloads to meet heat and performance needs.
QCT worked with Intel to develop the QCT QoolRack, a rack-level direct-to-chip cooling solution which meets data center needs with impressive cooling power savings per rack over air cooled solutions, and reduces data centers’ carbon footprint with QCT QoolRack smart management.
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