July 16, 2020
Standards group JEDEC announced the publication of the DDR5 SDRAM spec, the next-generation standard for random access memory (RAM). Compared to DDR4, the DDR5 Read more…
October 24, 2017
It’s no secret memory-to-processor bottlenecks have become a chief obstacle in boosting computer performance. Recent efforts to place DRAM onto chip packages Read more…
August 27, 2015
In a packed session at IDF 2015 in San Francisco last week, Scott Graham, Micron’s general manager of Hybrid Memory, discussed some of the key themes occurrin Read more…
August 28, 2013
The market for computer memory is entering a period of punctuated evolution as a result of several forces, including the continued growth of mobile devices like smartphones and tablets, as well as growth in the cloud data centers and communication networks that serve data to mobile users. HPC workloads also play a part in the changing memory landscape. Read more…
March 21, 2013
This week at NVIDIA's GPU Technology Conference, the priorities for GPU computing's future, including providing snappy access to high memory bandwidth, were cited as critical to growing user ranks. The energy consumption, data volume and velocity requirements are giving way to new, more efficient and higher bandwidth approaches, including Volta, which was revealed during the keynote event. Read more…
July 10, 2012
Computer memory is currently undergoing something of an identity crisis. For the past 8 years, multicore microprocessors have been creating a performance discontinuity, the so-called memory wall. It's now fairly clear that this widening gap between compute and memory performance will not be solved with conventional DRAM products. But there is one technology under development that aims to close that gap, and its first use case will likely be in the ethereal realm of supercomputing. Read more…
June 26, 2012
Researchers look to boost speed of phase change memory. Read more…
Today, manufacturers of all sizes face many challenges. Not only do they need to deliver complex products quickly, they must do so with limited resources while continuously innovating and improving product quality. With the use of computer-aided engineering (CAE), engineers can design and test ideas for new products without having to physically build many expensive prototypes. This helps lower costs, enhance productivity, improve quality, and reduce time to market.
As the scale and scope of CAE grows, manufacturers need reliable partners with deep HPC and manufacturing expertise. Together with AMD, HPE provides a comprehensive portfolio of high performance systems and software, high value services, and an outstanding ecosystem of performance optimized CAE applications to help manufacturing customers reduce costs and improve quality, productivity, and time to market.
Read this whitepaper to learn how HPE and AMD set a new standard in CAE solutions for manufacturing and can help your organization optimize performance.
A workload-driven system capable of running HPC/AI workloads is more important than ever. Organizations face many challenges when building a system capable of running HPC and AI workloads. There are also many complexities in system design and integration. Building a workload driven solution requires expertise and domain knowledge that organizational staff may not possess.
This paper describes how Quanta Cloud Technology (QCT), a long-time Intel® partner, developed the Taiwania 2 and Taiwania 3 supercomputers to meet the research needs of the Taiwan’s academic, industrial, and enterprise users. The Taiwan National Center for High-Performance Computing (NCHC) selected QCT for their expertise in building HPC/AI supercomputers and providing worldwide end-to-end support for solutions from system design, through integration, benchmarking and installation for end users and system integrators to ensure customer success.
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