June 20, 2023
Hot off the heels of the announcement of Sweden’s Arrhenius system yesterday, the EuroHPC Joint Undertaking (JU) has announced the hosts and operators of Euro Read more…
March 16, 2022
Intel has announced that it is making an “initial” €33 billion (~$36 billion) investment across the semiconductor value chain in Europe. The investment — which spans R&D, manufacturing and packaging — comes at a time when sovereignty is, more than ever, a headline priority for the continent. What was announced? A “Silicon Junction” in Germany with two new fabs... Read more…
July 16, 2021
Throughout the COVID-19 pandemic, AMD has positioned itself as a strong ally to the COVID-19 research community, predominantly through its COVID-19 High Perform Read more…
January 22, 2019
HPE announced today that it won the contract to build a supercomputer that will drive France’s AI and HPC efforts. The computer will be part of GENCI, the Fre Read more…
July 16, 2018
RIKEN in Japan and the French Alternative Energies and Atomic Energy Commission (CEA) formed a five-year cooperative research effort on January 11, 2017, to ad Read more…
July 2, 2015
Today’s launch by IBM, NVIDIA, and Mellanox of a new POWER Acceleration and Design Center in Montpellier, France, ratchets up their campaign to attract a wide Read more…
July 2, 2014
In many ways, Bull has been a mirror, reflecting companies like Cray from across the Atlantic. One on the one hand, both companies have deep roots in supercompu Read more…
April 18, 2014
If you don't reside within France or European borders you may not have heard of HPC-SME (or HPC-PME in French), yet this initiative – supported by GENCI, INRI Read more…
Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC processing generate excessive heat which results in higher data center power consumption and additional data center costs.
Data centers traditionally use air cooling solutions including heatsinks and fans that may not be able to reduce energy consumption while maintaining infrastructure performance for AI and HPC workloads. Liquid cooled systems will be increasingly replacing air cooled solutions for data centers running HPC and AI workloads to meet heat and performance needs.
QCT worked with Intel to develop the QCT QoolRack, a rack-level direct-to-chip cooling solution which meets data center needs with impressive cooling power savings per rack over air cooled solutions, and reduces data centers’ carbon footprint with QCT QoolRack smart management.
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