January 5, 2023
At the tail end of AMD’s 75-minute CES keynote, held yesterday in Las Vegas and via livestream, CEO Lisa Su shared new details of the forthcoming MI300 chip and publicly unveiled the silicon. The MI300 (teased earlier this year) is the first to combine a CPU, GPU and memory into a single integrated design, incorporating nine 5nm chiplets that are 3D stacked on top of four 6nm chiplets with 128 gigabytes of HBM3 memory. Read more…
December 2, 2022
The Frontier supercomputer – still fresh off its chart-topping 1.1 Linpack exaflops run and maintaining its number-one spot on the Top500 list – was still v Read more…
November 17, 2022
At the awards ceremony at SC22 in Dallas today, ACM awarded the 2022 ACM Gordon Bell Prize to a team of researchers who used four major supercomputers – inclu Read more…
November 14, 2022
The 60th edition of the Top500 list, revealed today at SC22 in Dallas, Texas, showcases many of the same systems as the previous installment, with Frontier stil Read more…
October 18, 2022
Exascale Computing Project Director Doug Kothe on the significance of this year's Exascale Day. Today, Oct. 18, is Exascale Day. This date was not chosen by chance; 10/18 pays homage to the power of exascale computing, in which systems are capable of performing 1018 calculations per second. Read more…
September 29, 2022
Two DOE-funded projects — and a bunch of top supercomputers — are converging to improve our understanding of earthquakes and enable the construction of more Read more…
September 7, 2022
The ACM Gordon Bell Prize, which comes with a $10,000 award courtesy of HPC luminary Gordon Bell, is widely considered the highest prize in high-performance com Read more…
September 1, 2022
New trade restrictions levied by the United States against China prohibit the sale of cutting-edge HPC and AI technologies from Nvidia and AMD to the world’s second-largest economy. In an SEC filing, Nvidia revealed it was prohibited from exporting its A100 and forthcoming H100 GPUs to China and Russia, effectively immediately. The stated purpose of the licensing requirements is to prevent “military end use” by these nations. Read more…
Today, manufacturers of all sizes face many challenges. Not only do they need to deliver complex products quickly, they must do so with limited resources while continuously innovating and improving product quality. With the use of computer-aided engineering (CAE), engineers can design and test ideas for new products without having to physically build many expensive prototypes. This helps lower costs, enhance productivity, improve quality, and reduce time to market.
As the scale and scope of CAE grows, manufacturers need reliable partners with deep HPC and manufacturing expertise. Together with AMD, HPE provides a comprehensive portfolio of high performance systems and software, high value services, and an outstanding ecosystem of performance optimized CAE applications to help manufacturing customers reduce costs and improve quality, productivity, and time to market.
Read this whitepaper to learn how HPE and AMD set a new standard in CAE solutions for manufacturing and can help your organization optimize performance.
A workload-driven system capable of running HPC/AI workloads is more important than ever. Organizations face many challenges when building a system capable of running HPC and AI workloads. There are also many complexities in system design and integration. Building a workload driven solution requires expertise and domain knowledge that organizational staff may not possess.
This paper describes how Quanta Cloud Technology (QCT), a long-time Intel® partner, developed the Taiwania 2 and Taiwania 3 supercomputers to meet the research needs of the Taiwan’s academic, industrial, and enterprise users. The Taiwan National Center for High-Performance Computing (NCHC) selected QCT for their expertise in building HPC/AI supercomputers and providing worldwide end-to-end support for solutions from system design, through integration, benchmarking and installation for end users and system integrators to ensure customer success.
© 2023 HPCwire. All Rights Reserved. A Tabor Communications Publication
HPCwire is a registered trademark of Tabor Communications, Inc. Use of this site is governed by our Terms of Use and Privacy Policy.
Reproduction in whole or in part in any form or medium without express written permission of Tabor Communications, Inc. is prohibited.