How AMD Used Its Chiplet Advantage to Design MI300X GPU and Bergamo CPU

June 14, 2023

Swap out a few silicon parts, and voila, you have a spanking new chip that did not take much work to design. That is how AMD's CEO, Lisa Su described the company making of its new MI300X GPU and its 128-core Epyc chip code-named Bergamo, which is targeted at dense server chips. Read more…

AMD Shows Off MI300 Chip for the First Time

January 5, 2023

At the tail end of AMD’s 75-minute CES keynote, held yesterday in Las Vegas and via livestream, CEO Lisa Su shared new details of the forthcoming MI300 chip and publicly unveiled the silicon. The MI300 (teased earlier this year) is the first to combine a CPU, GPU and memory into a single integrated design, incorporating nine 5nm chiplets that are 3D stacked on top of four 6nm chiplets with 128 gigabytes of HBM3 memory.  Read more…

AMD Thrives in Servers amid Intel Restructuring, Layoffs

November 12, 2022

Chipmakers regularly indulge in a game of brinkmanship, with an example being Intel and AMD trying to upstage one another with server chip launches this week. But each of those companies are in different positions, with AMD playing its traditional role of a scrappy underdog trying to unseat the behemoth Intel... Read more…

AMD’s Genoa CPUs Offer Up to 96 5nm Cores Across 12 Chiplets

November 10, 2022

AMD’s fourth-generation Epyc processor line has arrived, starting with the “general-purpose” architecture, called “Genoa,” the successor to third-gen Eypc Milan, which debuted in March of last year. At a launch event held today in San Francisco, AMD announced the general availability of the latest Epyc CPUs with up to 96 TSMC 5nm Zen 4 cores... Read more…

HPE Adapting New Server Hardware to Changing Cloud Models

November 1, 2022

Server hardware has taken a backseat to software-defined virtual machines handling datacenter workloads, but HPE is emphasizing the importance of hardware in these virtual operating models. HPE created waves when it released the next-generation ProLiant Gen11 servers with a flagship server based on Arm CPUs, which sent a strong... Read more…

HPE to Build 100+ Petaflops Shaheen III Supercomputer

September 27, 2022

The King Abdullah University of Science and Technology (KAUST) in Saudi Arabia has announced that HPE has won the bid to build the Shaheen III supercomputer. Sh Read more…

AMD Launches Milan-X CPU with 3D V-Cache and Multichip Instinct MI200 GPU

November 8, 2021

At a virtual event this morning, AMD CEO Lisa Su unveiled the company’s latest and much-anticipated server products: the new Milan-X CPU, which leverages AMD’s new 3D V-Cache technology; and its new Instinct MI200 GPU, which provides up to 220 compute units across two Infinity Fabric-connected dies, delivering an astounding 47.9 peak double-precision teraflops. “We're in a high-performance... Read more…

Exascale Watch: El Capitan Will Use AMD CPUs & GPUs to Reach 2 Exaflops

March 4, 2020

HPE and its collaborators reported today that El Capitan, the forthcoming exascale supercomputer to be sited at Lawrence Livermore National Laboratory and serve Read more…

  • arrow
  • Click Here for More Headlines
  • arrow

Whitepaper

How Direct Liquid Cooling Improves Data Center Energy Efficiency

Data centers are experiencing increasing power consumption, space constraints and cooling demands due to the unprecedented computing power required by today’s chips and servers. HVAC cooling systems consume approximately 40% of a data center’s electricity. These systems traditionally use air conditioning, air handling and fans to cool the data center facility and IT equipment, ultimately resulting in high energy consumption and high carbon emissions. Data centers are moving to direct liquid cooled (DLC) systems to improve cooling efficiency thus lowering their PUE, operating expenses (OPEX) and carbon footprint.

This paper describes how CoolIT Systems (CoolIT) meets the need for improved energy efficiency in data centers and includes case studies that show how CoolIT’s DLC solutions improve energy efficiency, increase rack density, lower OPEX, and enable sustainability programs. CoolIT is the global market and innovation leader in scalable DLC solutions for the world’s most demanding computing environments. CoolIT’s end-to-end solutions meet the rising demand in cooling and the rising demand for energy efficiency.

Download Now

Sponsored by CoolIT

Whitepaper

Transforming Industrial and Automotive Manufacturing

Divergent Technologies developed a digital production system that can revolutionize automotive and industrial scale manufacturing. Divergent uses new manufacturing solutions and their Divergent Adaptive Production System (DAPS™) software to make vehicle manufacturing more efficient, less costly and decrease manufacturing waste by replacing existing design and production processes.

Divergent initially used on-premises workstations to run HPC simulations but faced challenges because their workstations could not achieve fast enough simulation times. Divergent also needed to free staff from managing the HPC system, CAE integration and IT update tasks.

Download Now

Sponsored by TotalCAE

Advanced Scale Career Development & Workforce Enhancement Center

Featured Advanced Scale Jobs:

SUBSCRIBE for monthly job listings and articles on HPC careers.

HPCwire Resource Library

HPCwire Product Showcase

Subscribe to the Monthly
Technology Product Showcase:

HPCwire