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AMD Shows Off MI300 Chip for the First Time
January 5, 2023
At the tail end of AMD’s 75-minute CES keynote, held yesterday in Las Vegas and via livestream, CEO Lisa Su shared new details of the forthcoming MI300 chip and publicly unveiled the silicon. The MI300 (teased earlier this year) is the first to combine a CPU, GPU and memory into a single integrated design, incorporating nine 5nm chiplets that are 3D stacked on top of four 6nm chiplets with 128 gigabytes of HBM3 memory. Read more…
AMD Thrives in Servers amid Intel Restructuring, Layoffs
November 12, 2022
Chipmakers regularly indulge in a game of brinkmanship, with an example being Intel and AMD trying to upstage one another with server chip launches this week. But each of those companies are in different positions, with AMD playing its traditional role of a scrappy underdog trying to unseat the behemoth Intel... Read more…
AMD’s Genoa CPUs Offer Up to 96 5nm Cores Across 12 Chiplets
November 10, 2022
AMD’s fourth-generation Epyc processor line has arrived, starting with the “general-purpose” architecture, called “Genoa,” the successor to third-gen Eypc Milan, which debuted in March of last year. At a launch event held today in San Francisco, AMD announced the general availability of the latest Epyc CPUs with up to 96 TSMC 5nm Zen 4 cores... Read more…
HPE Adapting New Server Hardware to Changing Cloud Models
November 1, 2022
Server hardware has taken a backseat to software-defined virtual machines handling datacenter workloads, but HPE is emphasizing the importance of hardware in these virtual operating models. HPE created waves when it released the next-generation ProLiant Gen11 servers with a flagship server based on Arm CPUs, which sent a strong... Read more…
HPE to Build 100+ Petaflops Shaheen III Supercomputer
September 27, 2022
The King Abdullah University of Science and Technology (KAUST) in Saudi Arabia has announced that HPE has won the bid to build the Shaheen III supercomputer. Sh Read more…
AMD Launches Milan-X CPU with 3D V-Cache and Multichip Instinct MI200 GPU
November 8, 2021
At a virtual event this morning, AMD CEO Lisa Su unveiled the company’s latest and much-anticipated server products: the new Milan-X CPU, which leverages AMD’s new 3D V-Cache technology; and its new Instinct MI200 GPU, which provides up to 220 compute units across two Infinity Fabric-connected dies, delivering an astounding 47.9 peak double-precision teraflops. “We're in a high-performance... Read more…
Exascale Watch: El Capitan Will Use AMD CPUs & GPUs to Reach 2 Exaflops
March 4, 2020
HPE and its collaborators reported today that El Capitan, the forthcoming exascale supercomputer to be sited at Lawrence Livermore National Laboratory and serve Read more…
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Whitepaper
A New Standard in CAE Solutions for Manufacturing
Today, manufacturers of all sizes face many challenges. Not only do they need to deliver complex products quickly, they must do so with limited resources while continuously innovating and improving product quality. With the use of computer-aided engineering (CAE), engineers can design and test ideas for new products without having to physically build many expensive prototypes. This helps lower costs, enhance productivity, improve quality, and reduce time to market.
As the scale and scope of CAE grows, manufacturers need reliable partners with deep HPC and manufacturing expertise. Together with AMD, HPE provides a comprehensive portfolio of high performance systems and software, high value services, and an outstanding ecosystem of performance optimized CAE applications to help manufacturing customers reduce costs and improve quality, productivity, and time to market.
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Sponsored by HPE
Whitepaper
Porting CUDA Applications to Run on AMD GPUs
A workload-driven system capable of running HPC/AI workloads is more important than ever. Organizations face many challenges when building a system capable of running HPC and AI workloads. There are also many complexities in system design and integration. Building a workload driven solution requires expertise and domain knowledge that organizational staff may not possess.
This paper describes how Quanta Cloud Technology (QCT), a long-time Intel® partner, developed the Taiwania 2 and Taiwania 3 supercomputers to meet the research needs of the Taiwan’s academic, industrial, and enterprise users. The Taiwan National Center for High-Performance Computing (NCHC) selected QCT for their expertise in building HPC/AI supercomputers and providing worldwide end-to-end support for solutions from system design, through integration, benchmarking and installation for end users and system integrators to ensure customer success.
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Sponsored by AMD
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