September 17, 2023
As reported in the South China Morning Post HPC pioneer Jack Dongarra mentioned the lack of benchmarks from recent HPC systems built by China. “It’s a we Read more…
February 8, 2023
During the awards ceremony at SC22 in Dallas, one reveal flew a bit under the radar amid the celebration: the introduction of a new Gordon Bell Prize that ACM P Read more…
November 17, 2022
For three years running, ACM has awarded not only its long-standing Gordon Bell Prize (read more about this year’s winner here!) but also its Gordon Bell Spec Read more…
November 17, 2022
At the awards ceremony at SC22 in Dallas today, ACM awarded the 2022 ACM Gordon Bell Prize to a team of researchers who used four major supercomputers – inclu Read more…
November 17, 2022
Large language models (LLMs) have taken the tech world by storm over the past couple of years, dominating headlines with their ability to generate convincing hu Read more…
September 7, 2022
The ACM Gordon Bell Prize, which comes with a $10,000 award courtesy of HPC luminary Gordon Bell, is widely considered the highest prize in high-performance com Read more…
August 12, 2022
Courtesy of the schedule for the SC22 conference, we now have our first glimpse at the finalists for this year’s coveted Gordon Bell Prize. The Gordon Bell Pr Read more…
March 11, 2022
Even the toughest materials on Earth are vulnerable under the most extreme conditions. A supercomputer simulation visualized just that by cracking, melting and Read more…
Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC processing generate excessive heat which results in higher data center power consumption and additional data center costs.
Data centers traditionally use air cooling solutions including heatsinks and fans that may not be able to reduce energy consumption while maintaining infrastructure performance for AI and HPC workloads. Liquid cooled systems will be increasingly replacing air cooled solutions for data centers running HPC and AI workloads to meet heat and performance needs.
QCT worked with Intel to develop the QCT QoolRack, a rack-level direct-to-chip cooling solution which meets data center needs with impressive cooling power savings per rack over air cooled solutions, and reduces data centers’ carbon footprint with QCT QoolRack smart management.
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