November 16, 2022
Europe’s sovereign approach to exascale computing is complicating plans for U.S. chipmakers to breakthrough in the market, and in the process, empowering local chipmakers. For one, a European chip startup called SiPearl is emerging as an early... Read more…
November 12, 2022
Chipmakers regularly indulge in a game of brinkmanship, with an example being Intel and AMD trying to upstage one another with server chip launches this week. But each of those companies are in different positions, with AMD playing its traditional role of a scrappy underdog trying to unseat the behemoth Intel... Read more…
August 24, 2022
Intel has been hyping up its media delivery and cloud gaming GPUs codenamed Arctic Sound-M, and has given a formal name: Flex Series GPUs. The Flex Series GPUs will sit in the cloud datacenters for AI inferencing and graphics – such as gaming and video – to remote devices. Intel's Vision conference in May was the coming-out party for the GPUs. Intel hasn't provided a clear shipment date for the... Read more…
August 22, 2022
Amid the high-performance GPU turf tussle between AMD and Nvidia (and soon, Intel), a new, China-based player is emerging: Biren Technology, founded in 2019 and headquartered in Shanghai. At Hot Chips 34, Biren co-founder and president Lingjie Xu and Biren CTO Mike Hong took the (virtual) stage to detail the company’s inaugural product: the Biren BR100 general-purpose GPU (GPGPU). “It is my honor to present... Read more…
August 16, 2022
Tesla has revealed that its biggest in-house AI supercomputer – which we wrote about last year – now has a total of 7,360 A100 GPUs, a nearly 28 percent uplift from its previous total of 5,760 GPUs. That’s enough GPU oomph for a top seven spot on the Top500, although the tech company best known for its electric vehicles has not publicly benchmarked the system. If it had, it would... Read more…
May 30, 2022
The 59th installment of the Top500 list, issued today from ISC 2022 in Hamburg, Germany, officially marks a new era in supercomputing with the debut of the first-ever exascale system on the list. Frontier, deployed at the Department of Energy’s Oak Ridge National Laboratory, achieved 1.102 exaflops in its fastest High Performance Linpack run, which was completed... Read more…
June 28, 2021
From the ISC 2021 Digital event, Intel announced it will offer Sapphire Rapids with integrated HBM, detailed new Xe-HPC GPU form factors, and introduced commercial support for DAOS (distributed application object storage). Intel also announced a new Ethernet solution, aimed at smaller-scale HPC. With integrated High Bandwidth Memory (HBM), the forthcoming Intel Xeon Scalable processors... Read more…
June 24, 2021
Four months after taking over the reins of Intel Corp., CEO Pat Gelsinger has announced a string of executive leadership changes as he works to shake things up inside a company that leads its marketplace but could use a boost in energy. The executive changes, unveiled on June 22 (Tuesday), include the promotions of two existing Intel execs... Read more…
Today, manufacturers of all sizes face many challenges. Not only do they need to deliver complex products quickly, they must do so with limited resources while continuously innovating and improving product quality. With the use of computer-aided engineering (CAE), engineers can design and test ideas for new products without having to physically build many expensive prototypes. This helps lower costs, enhance productivity, improve quality, and reduce time to market.
As the scale and scope of CAE grows, manufacturers need reliable partners with deep HPC and manufacturing expertise. Together with AMD, HPE provides a comprehensive portfolio of high performance systems and software, high value services, and an outstanding ecosystem of performance optimized CAE applications to help manufacturing customers reduce costs and improve quality, productivity, and time to market.
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A workload-driven system capable of running HPC/AI workloads is more important than ever. Organizations face many challenges when building a system capable of running HPC and AI workloads. There are also many complexities in system design and integration. Building a workload driven solution requires expertise and domain knowledge that organizational staff may not possess.
This paper describes how Quanta Cloud Technology (QCT), a long-time Intel® partner, developed the Taiwania 2 and Taiwania 3 supercomputers to meet the research needs of the Taiwan’s academic, industrial, and enterprise users. The Taiwan National Center for High-Performance Computing (NCHC) selected QCT for their expertise in building HPC/AI supercomputers and providing worldwide end-to-end support for solutions from system design, through integration, benchmarking and installation for end users and system integrators to ensure customer success.
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