September 17, 2023
As reported in the South China Morning Post HPC pioneer Jack Dongarra mentioned the lack of benchmarks from recent HPC systems built by China. “It’s a we Read more…
May 18, 2023
The ASC23 cluster competition was held in a basketball stadium on the campus of the University of Science and Technology of China, located in Hefei, China – Read more…
May 17, 2023
The tenth edition of the Asian Supercomputing Challenge took place last week in Hefei, China, and it was tougher than ever. 24 university teams (20 on site, 4 Read more…
June 22, 2020
A new Top500 champ was unveiled today. Supercomputer Fugaku, the pride of Japan and the namesake of Mount Fuji, vaulted to the top of the 55th edition of the To Read more…
April 18, 2016
The fifth annual Asia Student Supercomputer Challenge (ASC16) got off to an exciting start this morning at the Huazhong University of Science and Technology (HUST) in Wuhan, the capital of Hubei province, China. Read more…
July 15, 2015
The TOP500 organizers published their 45th twice-yearly list this week in tandem with ISC 2015 in Frankfurt, Germany. What is becoming increasingly clear, as o Read more…
December 1, 2014
One of the most heated debates in supercomputing circles over the last several years has been around the continued validity of the current basis of the Top 500 Read more…
June 26, 2014
One of the undisputed themes at ISC14 was the continued speculation about how the Top500 Linpack benchmark will keep pace with evolving system and application d Read more…
Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC processing generate excessive heat which results in higher data center power consumption and additional data center costs.
Data centers traditionally use air cooling solutions including heatsinks and fans that may not be able to reduce energy consumption while maintaining infrastructure performance for AI and HPC workloads. Liquid cooled systems will be increasingly replacing air cooled solutions for data centers running HPC and AI workloads to meet heat and performance needs.
QCT worked with Intel to develop the QCT QoolRack, a rack-level direct-to-chip cooling solution which meets data center needs with impressive cooling power savings per rack over air cooled solutions, and reduces data centers’ carbon footprint with QCT QoolRack smart management.
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