November 23, 2022
The ability to scale current computing designs is reaching a breaking point, and chipmakers such as Intel, Qualcomm and AMD are putting their brains together on an alternate architecture to push computing forward. The chipmakers are coalescing around the new concept of sparse computing, which involves bringing computing to data... Read more…
December 14, 2021
Earlier this month, the Intelligence Advanced Research Projects Activity (IARPA) and the U.S. Army Combat Capabilities Development Command’s Army Research issued a call for proposals to build a new computer architecture to handle the growing flood of data. “Clean sheet designs are needed to address today’s era of explosive data growth,” said IARPA AGILE program manager, William Harrod. “ Read more…
January 16, 2018
U.S. military and intelligence agencies continue to look for new ways to use artificial intelligence to sift through huge amounts of video imagery in hopes of f Read more…
August 2, 2017
The rising cost of building secure on premise infrastructure and increasing concerns around security are prompting the Intelligence Advanced Research Projects A Read more…
February 22, 2016
Depending upon your perspective Artificial Intelligence is stuck in the doldrums. Its long touted promise has yet to materialize and instead produced boom-bust Read more…
May 14, 2015
Engineers at IBM have developed a fully integrated wavelength multiplexed silicon photonics chip, which the company says will soon enable manufacturing of 100 G Read more…
January 22, 2015
US intelligence officials have set in motion a five-year project to spark progress in machine learning by reverse-engineering the algorithms of the human brain. Read more…
December 9, 2014
The Intelligence Advanced Research Projects Activity (IARPA) has officially commenced a multi-year research effort to develop a superconducting computer as a lo Read more…
Today, manufacturers of all sizes face many challenges. Not only do they need to deliver complex products quickly, they must do so with limited resources while continuously innovating and improving product quality. With the use of computer-aided engineering (CAE), engineers can design and test ideas for new products without having to physically build many expensive prototypes. This helps lower costs, enhance productivity, improve quality, and reduce time to market.
As the scale and scope of CAE grows, manufacturers need reliable partners with deep HPC and manufacturing expertise. Together with AMD, HPE provides a comprehensive portfolio of high performance systems and software, high value services, and an outstanding ecosystem of performance optimized CAE applications to help manufacturing customers reduce costs and improve quality, productivity, and time to market.
Read this whitepaper to learn how HPE and AMD set a new standard in CAE solutions for manufacturing and can help your organization optimize performance.
A workload-driven system capable of running HPC/AI workloads is more important than ever. Organizations face many challenges when building a system capable of running HPC and AI workloads. There are also many complexities in system design and integration. Building a workload driven solution requires expertise and domain knowledge that organizational staff may not possess.
This paper describes how Quanta Cloud Technology (QCT), a long-time Intel® partner, developed the Taiwania 2 and Taiwania 3 supercomputers to meet the research needs of the Taiwan’s academic, industrial, and enterprise users. The Taiwan National Center for High-Performance Computing (NCHC) selected QCT for their expertise in building HPC/AI supercomputers and providing worldwide end-to-end support for solutions from system design, through integration, benchmarking and installation for end users and system integrators to ensure customer success.
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