Intel Labs Launches Neuromorphic ‘Kapoho Point’ Board

September 28, 2022

Over the past five years, Intel has been iterating on its neuromorphic chips and systems, aiming to create devices (and software for those devices) that closely Read more…

Neuromorphic Computing to Assist Children Who Use Wheelchairs

August 20, 2020

Intel’s neuromorphic chip has learned to smell, learned to touch – and now, it’s here to help. The chip, which mimics the behavior of the human brain, is Read more…

Earthquake Simulation Scales to 8.6 Petaflops

August 14, 2014

Intel Labs Vision Stategist Divya Kolar explores how supercomputing is helping society prepare for earthquakes. Current earthquake early warning systems are v Read more…

The Weekly Top Five – 02/03/2011

February 3, 2011

The Weekly Top Five features the five biggest HPC stories of the week, condensed for your reading pleasure. This week, we cover the computing power on display at SC10's Student Cluster Competition; the University of Portsmouth's new supercomputer; IBM Watson's SUSE Linux platform; multicore advances at North Carolina State; and Intel's new approach to university funding. Read more…

Terascale Memory Challenges and Solutions

December 6, 2010

In contrast to the previous decade, CPU clock rates are scaling slower over time due to the power constraints. However, the number of transistors per silicon area continue to increase roughly at the rate of Moore's Law. Therefore, CPUs are being designed and built with an increasing number of cores, with each core executing one or more threads of instructions. This puts a new kind of pressure on the memory subsystem. Read more…

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Whitepaper

QCT QoolRack: An Optimized Liquid Cooling Solution for HPC/AI Workloads

Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC processing generate excessive heat which results in higher data center power consumption and additional data center costs.

Data centers traditionally use air cooling solutions including heatsinks and fans that may not be able to reduce energy consumption while maintaining infrastructure performance for AI and HPC workloads. Liquid cooled systems will be increasingly replacing air cooled solutions for data centers running HPC and AI workloads to meet heat and performance needs.

QCT worked with Intel to develop the QCT QoolRack, a rack-level direct-to-chip cooling solution which meets data center needs with impressive cooling power savings per rack over air cooled solutions, and reduces data centers’ carbon footprint with QCT QoolRack smart management.

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