<img style=”float: left;” src=”http://media2.hpcwire.com/hpcwire/Intel_fabric_controller.bmp” alt=”” width=”117″ height=”59″ />It’s been a good year for interconnect maker Mellanox. The company has been riding high in 2012, thanks in large part to its dominant position in the InfiniBand marketplace and the surge in FDR sales over the last several months. But with Intel now eyeing the lucrative high performance interconnect market, Mellanox may soon face a formidable challenge as InfiniBand kingpin.
<img style=”float: left;” src=”http://media2.hpcwire.com/hpcwire/computer_chips_on_die_small.jpg” alt=”” width=”94″ height=”85″ />Intel has begun to formulate a strategy that will integrate fabric controllers with its server processors. According to Raj Hazra, general manager of the Technical Computing unit at Intel, the company is planning to use the recently acquired IP from Cray, QLogic and Fulcrum to deliver chips that put what is essentially a NIC onto the processor die. In a recent conversation with Hazra, he outlined their new fabric interconnect strategy.
Cloud technologies have become integral to a number of services including video streaming, file sharing and social media to name a few. But when it comes to HPC applications, the benefits don’t always translate.
Chief scientist discusses memory stacks, interconnects, and US technology leadership.
<img style=”float: left;” src=”http://media2.hpcwire.com/hpcwire/Cray_Gemini_schematic_small.bmp” alt=”” width=”122″ height=”82″ />Supercomputer maker Cray is methodically and inevitably shifting its technology focus from hardware to software. Another step in that direction played itself out this week in the company’s sale of its highly treasured supercomputing interconnect technology. On Tuesday evening, Cray and Intel announced that they signed a “definitive agreement” that would send the interconnect program and expertise to the x86 chipmaker.
<img style=”float: left;” src=”http://media2.hpcwire.com/hpcwire/Intel_Cray.JPG” alt=”” width=”91″ height=”77″ />At first glance, the announced acquisition of Cray’s interconnect technology by Intel comes as a surprise to the HPC community, simply because Cray still stands for innovation, and with this deal they are selling one of their last proprietary assets. At second glance, however, you find a couple of good reasons, from the perspective of both parties, which makes it a win-win situation, at least in the short-term.
Ellison and company put some big bucks behind InfiniBand.
Russian supercomputer maker T-Platforms is continuing its push into the elite end of the HPC market. On Monday, the company announced a joint venture with a group at the University of Heidelberg to develop a new ultra-fast interconnect for high-end supercomputing. The goal is to bring the technology to market in the form of an ASIC, which can be incorporated into a network interface controller for HPC servers.
Last week, the InfiniBand Trade Association (IBTA) used the International Supercomputing Conference (ISC’10) to unveil the new roadmap for InfiniBand. In a nutshell, the IBTA is moving the technology to 104 Gbps, using a new coding scheme that promises 100 Gbps of useful data in a 4-lane configuration.
Supercomputer maker Cray did a pre-launch of sorts for its upcoming “Baker” supercomputer on Tuesday, giving the machine its official product designation: the XE6. Although the company won’t be shipping the hardware until later this year, there’s already a backlog of orders for the petascale machines, and Cray is setting the stage for a big debut.