June 8, 2023
About a year ago, the LUMI supercomputer – a EuroHPC system based at a CSC datacenter in Kajaani, Finland – debuted in third place on the Top500 list (a pos Read more…
May 10, 2023
Cloud providers are building armies of GPUs to provide more AI firepower. Google is joining the gang with a new supercomputer that has almost 2.5 times the number of GPUs than the world’s third-fastest supercomputer called LUMI. Google announced an AI supercomputer with 26,000 GPUs at its developer conference on Wednesday. Read more…
May 1, 2023
Following the EuroHPC Summit conference in Gothenburg, Sweden, last month, HPCwire asked Steve Conway, senior analyst at Intersect360 Research, to interview And Read more…
April 12, 2023
Generative AI is taking the tech world – and the broader world – by storm, but relatively little word has come out of the major supercomputer centers amid t Read more…
March 30, 2023
When the EuroHPC Summit was held last week in Gothenburg, there was a distinct shift in tone for the maturing supercomputing play. With LUMI and Leonardo – pl Read more…
March 24, 2023
As the 2023 EuroHPC Summit opened in Gothenburg on Monday, Herbert Zeisel – chair of EuroHPC’s Governing Board – commented that the undertaking had “lef Read more…
March 13, 2023
CSC, Finland’s scientific IT center, is now most famous for its LUMI system, launched in partnership with EuroHPC and landing third on the most recent Top500 Read more…
February 14, 2023
Each November, HPCwire’s readers and editors recognize dozens of individuals and organizations across more than 20 very serious award categories, celebrating Read more…
Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC processing generate excessive heat which results in higher data center power consumption and additional data center costs.
Data centers traditionally use air cooling solutions including heatsinks and fans that may not be able to reduce energy consumption while maintaining infrastructure performance for AI and HPC workloads. Liquid cooled systems will be increasingly replacing air cooled solutions for data centers running HPC and AI workloads to meet heat and performance needs.
QCT worked with Intel to develop the QCT QoolRack, a rack-level direct-to-chip cooling solution which meets data center needs with impressive cooling power savings per rack over air cooled solutions, and reduces data centers’ carbon footprint with QCT QoolRack smart management.
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