April 27, 2022
In a one-two punch of new HPC-backed AI announcements, Hewlett Packard Enterprise (HPE) today announced its new Machine Learning Development System (MLDS) and S Read more…
January 26, 2022
Earlier this month, the White House Office of Science and Technology Policy (OSTP) Scientific Integrity Task Force released a report titled “Protecting the In Read more…
October 15, 2021
With more and more enterprises turning to AI for a myriad of tasks, companies quickly find out that training AI models is expensive, difficult and time-consuming. Finding a new approach to deal with those cascading challenges is the aim of a new startup, MosaicML, that just came out of stealth... Read more…
September 27, 2021
Making sense of ML performance and benchmark data is an ongoing challenge. In light of last week’s release of the most recent MLPerf (v1.1) inference results, now is perhaps a good time to review how valuable (or not) such ML benchmarks are and the challenges they face. Two researchers... Read more…
September 3, 2021
As datasets get larger and larger, the potential of machine learning insights from those datasets grows correspondingly immense – but bottlenecks in computing Read more…
August 27, 2021
Esperanto Technologies made waves last December when it announced ET-SoC-1, a new RISC-V-based chip aimed at machine learning that packed nearly 1,100 cores onto a package small enough to fit six times over on a single PCIe card. Now, Esperanto is back, silicon in-hand and taking aim... Read more…
August 7, 2021
For nearly a hundred years, German-based firm Festo has delivered industrial controls and automation tools to its clients, growing to over 20,000 employees and Read more…
June 30, 2021
While Nvidia (again) dominated the latest round of MLPerf training benchmark results, the range of participants expanded. Notably, Google’s forthcoming TPU v4 Read more…
Today, manufacturers of all sizes face many challenges. Not only do they need to deliver complex products quickly, they must do so with limited resources while continuously innovating and improving product quality. With the use of computer-aided engineering (CAE), engineers can design and test ideas for new products without having to physically build many expensive prototypes. This helps lower costs, enhance productivity, improve quality, and reduce time to market.
As the scale and scope of CAE grows, manufacturers need reliable partners with deep HPC and manufacturing expertise. Together with AMD, HPE provides a comprehensive portfolio of high performance systems and software, high value services, and an outstanding ecosystem of performance optimized CAE applications to help manufacturing customers reduce costs and improve quality, productivity, and time to market.
Read this whitepaper to learn how HPE and AMD set a new standard in CAE solutions for manufacturing and can help your organization optimize performance.
A workload-driven system capable of running HPC/AI workloads is more important than ever. Organizations face many challenges when building a system capable of running HPC and AI workloads. There are also many complexities in system design and integration. Building a workload driven solution requires expertise and domain knowledge that organizational staff may not possess.
This paper describes how Quanta Cloud Technology (QCT), a long-time Intel® partner, developed the Taiwania 2 and Taiwania 3 supercomputers to meet the research needs of the Taiwan’s academic, industrial, and enterprise users. The Taiwan National Center for High-Performance Computing (NCHC) selected QCT for their expertise in building HPC/AI supercomputers and providing worldwide end-to-end support for solutions from system design, through integration, benchmarking and installation for end users and system integrators to ensure customer success.
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