Datanami
EnterpriseAI
HPCwire Japan
QCwire
HPC & AI Wall Street
Intel’s Server Chips Are ‘Lead Vehicles’ for Manufacturing Strategy
March 30, 2023
…But chipmaker still does not have an integrated product strategy, which puts the company behind AMD and Nvidia. Intel finally has a full complement of server and PC chips it will release in the coming years, which will determine whether it has regained its leadership in chip manufacturing. The chipmaker this week... Read more…
GM, National Labs Pave the Way for Next-Gen Vehicles
October 5, 2022
For the better part of a century, General Motors (GM) was the biggest automaker in the world. Now, amid a paradigm shift toward smarter, electrified vehicles, t Read more…
LBNL, Cornell Researchers Push Towards Low Power Devices
September 28, 2016
Pairing ferroelectric and ferrimagnetic materials so that their alignment can be controlled with a small electric field at near room temperatures has long been Read more…
Haswell’s New Instructions Benefit FEA Performance
April 2, 2015
Intel recently published a case study that demonstrates the advantages of the Intel Xeon E5-2600 v3 product family for running engineering workloads, using Read more…
Reaping the Benefits of HPC-Driven Product Development
January 8, 2015
The high-stakes global market place with its razor-thin margins has been a boon for innovative solutions and technologies, like high-performance computing, whic Read more…
UK Project Tackles Bike Helmet Safety
November 13, 2014
There are certain HPC projects that stand out for their ability to help humankind in practical ways. One recent example of such a project combines state-of-the- Read more…
A Platform for Smart Manufacturing
September 25, 2014
21st century market dynamics put a great deal of pressure on manufacturers to operate differently. Driving forces are many but include the need to satisfy custo Read more…
Boosting HPC Access in SME Community
April 18, 2014
If you don't reside within France or European borders you may not have heard of HPC-SME (or HPC-PME in French), yet this initiative – supported by GENCI, INRI Read more…
- Click Here for More Headlines
Leading Solution Providers
Whitepaper
Penguin Computing Scyld Cloud Central™: A New Cloud-First Approach to HPC and AI Workloads
Making the Most of Today’s Cloud-First Approach to Running HPC and AI Workloads With Penguin Scyld Cloud Central™
Bursting to cloud has long been used to complement on-premises HPC capacity to meet variable compute demands. But in today’s age of cloud, many workloads start on the cloud with little IT or corporate oversight. What is needed is a way to operationalize the use of these cloud resources so that users get the compute power they need when they need it, but with constraints that take costs and the efficient use of existing compute power into account. Download this special report to learn more about this topic.
Download Now
Sponsored by Penguin Solutions
Whitepaper
QCT POD- An Adaptive Converged Platform for HPC and AI
Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC processing generate excessive heat which results in higher data center power consumption and additional data center costs.
Data centers traditionally use air cooling solutions including heatsinks and fans that may not be able to reduce energy consumption while maintaining infrastructure performance for AI and HPC workloads. Liquid cooled systems will be increasingly replacing air cooled solutions for data centers running HPC and AI workloads to meet heat and performance needs.
QCT worked with Intel to develop the QCT QoolRack, a rack-level direct-to-chip cooling solution which meets data center needs with impressive cooling power savings per rack over air cooled solutions, and reduces data centers’ carbon footprint with QCT QoolRack smart management.
Download Now
Sponsored by QCT
Advanced Scale Career Development & Workforce Enhancement Center
Featured Advanced Scale Jobs:
HPCwire Resource Library
HPCwire Product Showcase
© 2023 HPCwire. All Rights Reserved. A Tabor Communications Publication
HPCwire is a registered trademark of Tabor Communications, Inc. Use of this site is governed by our Terms of Use and Privacy Policy.
Reproduction in whole or in part in any form or medium without express written permission of Tabor Communications, Inc. is prohibited.