October 7, 2021
At its VMworld 2021 event this week, VMware introduced Project Capitola, a new company-led effort to use its vSphere software to virtualize application access t Read more…
March 16, 2021
After almost 10 years of investments and flagging progress, Micron announced today (Tuesday) that it is ending its involvement in 3D XPoint, the non-volatile me Read more…
February 17, 2021
Samsung today announced what it’s calling the industry’s first high bandwidth memory (HBM) memory with built-in AI processing capability. The new device – Read more…
February 2, 2021
Frontera, the world’s largest academic supercomputer housed at the Texas Advanced Computing Center (TACC), is big both in terms of number of computational nodes and the capabilities of the large memory “fat” compute nodes. A couple of recent use cases demonstrate how academic researchers... Read more…
January 21, 2021
Pursuit of in-memory computing has long been an active area with recent progress showing promise. Just how in-memory computing works, how close it is to practic Read more…
January 5, 2021
Competition to leverage new memory and storage hardware with new or improved software to create better storage/memory schemes has steadily gathered steam during Read more…
November 16, 2020
Nvidia has doubled the memory of its previous supercomputing GPUs with its new A100 80GB GPU, which aims to drive new levels of supercomputing performance in a wide variety of uses, from AI and ML research to engineering and more. The new A100 80GB GPU comes just six months... Read more…
October 21, 2020
In a sign that its 3D XPoint memory technology is gaining traction, Intel Corp. is departing the NAND flash memory and storage market with the sale of its manuf Read more…
Today, manufacturers of all sizes face many challenges. Not only do they need to deliver complex products quickly, they must do so with limited resources while continuously innovating and improving product quality. With the use of computer-aided engineering (CAE), engineers can design and test ideas for new products without having to physically build many expensive prototypes. This helps lower costs, enhance productivity, improve quality, and reduce time to market.
As the scale and scope of CAE grows, manufacturers need reliable partners with deep HPC and manufacturing expertise. Together with AMD, HPE provides a comprehensive portfolio of high performance systems and software, high value services, and an outstanding ecosystem of performance optimized CAE applications to help manufacturing customers reduce costs and improve quality, productivity, and time to market.
Read this whitepaper to learn how HPE and AMD set a new standard in CAE solutions for manufacturing and can help your organization optimize performance.
A workload-driven system capable of running HPC/AI workloads is more important than ever. Organizations face many challenges when building a system capable of running HPC and AI workloads. There are also many complexities in system design and integration. Building a workload driven solution requires expertise and domain knowledge that organizational staff may not possess.
This paper describes how Quanta Cloud Technology (QCT), a long-time Intel® partner, developed the Taiwania 2 and Taiwania 3 supercomputers to meet the research needs of the Taiwan’s academic, industrial, and enterprise users. The Taiwan National Center for High-Performance Computing (NCHC) selected QCT for their expertise in building HPC/AI supercomputers and providing worldwide end-to-end support for solutions from system design, through integration, benchmarking and installation for end users and system integrators to ensure customer success.
© 2023 HPCwire. All Rights Reserved. A Tabor Communications Publication
HPCwire is a registered trademark of Tabor Communications, Inc. Use of this site is governed by our Terms of Use and Privacy Policy.
Reproduction in whole or in part in any form or medium without express written permission of Tabor Communications, Inc. is prohibited.