AMD Shows Off MI300 Chip for the First Time

January 5, 2023

At the tail end of AMD’s 75-minute CES keynote, held yesterday in Las Vegas and via livestream, CEO Lisa Su shared new details of the forthcoming MI300 chip and publicly unveiled the silicon. The MI300 (teased earlier this year) is the first to combine a CPU, GPU and memory into a single integrated design, incorporating nine 5nm chiplets that are 3D stacked on top of four 6nm chiplets with 128 gigabytes of HBM3 memory.  Read more…

Top500: Exascale Is Officially Here with Debut of Frontier

May 30, 2022

The 59th installment of the Top500 list, issued today from ISC 2022 in Hamburg, Germany, officially marks a new era in supercomputing with the debut of the first-ever exascale system on the list. Frontier, deployed at the Department of Energy’s Oak Ridge National Laboratory, achieved 1.102 exaflops in its fastest High Performance Linpack run, which was completed... Read more…

HPE, AMD to Power New French Supercomputer ‘Adastra’

November 15, 2021

HPE – working with France’s HPC agency, GENCI, and its National Computing Center for Higher Education, CINES – announced a stellar win today at SC21: it will build France’s 70 peak petaflops Adastra supercomputer, scheduling another leading system for delivery in Europe on the heels of a string of EuroHPC system debuts. The system, slated for delivery and... Read more…

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How Direct Liquid Cooling Improves Data Center Energy Efficiency

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