Datanami
EnterpriseAI
HPCwire Japan
QCwire
HPC & AI Wall Street
ISC Preview: Focus Will Be on Top500 and HPC Diversity
May 9, 2024
Last year's Supercomputing 2023 in November had record attendance, but the direction of high-performance computing was a hot topic on the floor. Expect more of Read more…
Intel’s Server and PC Chip Development Will Blur After 2025
January 15, 2024
Intel's dealing with much more than chip rivals breathing down its neck; it is simultaneously integrating a bevy of new technologies such as chiplets, artificia Read more…
AMD Has a GPU to Rival Nvidia’s H100
June 13, 2023
If you have not been lucky enough to find Nvidia’s prized H100 GPU in the cloud or off the shelf, AMD has a challenger waiting in the wings that could be worth considering. AMD announced the new MI300X GPU, which is targeted at AI and scientific computing. Read more…
AMD Revenues Drop, but Company Expects Datacenter Wins Later in 2023
May 2, 2023
Today, AMD reported its financial results for Q1 2023. The headline: revenues ($5.4 billion) are down by 9.2% year-over-year, just barely beating expectations a Read more…
A Zettascale Computer Today Would Need 21 Nuclear Power Plants
February 21, 2023
If a zettascale computer were assembled using today's supercomputing technologies, it would consume about 21 gigawatts, or equivalent to the energy produced by 21 nuclear power plants. The math was presented in a keynote speech by AMD CEO Lisa Su at the ISSCC trade show being held in San Francisco held this week. A zettaflop supercomputer would have the computing capability... Read more…
AMD Shows Off MI300 Chip for the First Time
January 5, 2023
At the tail end of AMD’s 75-minute CES keynote, held yesterday in Las Vegas and via livestream, CEO Lisa Su shared new details of the forthcoming MI300 chip and publicly unveiled the silicon. The MI300 (teased earlier this year) is the first to combine a CPU, GPU and memory into a single integrated design, incorporating nine 5nm chiplets that are 3D stacked on top of four 6nm chiplets with 128 gigabytes of HBM3 memory. Read more…
- Click Here for More Headlines
Leading Solution Providers
Whitepaper
From Hallucination to Reality
As Federal agencies navigate an increasingly complex and data-driven world, learning how to get the most out of high-performance computing (HPC), artificial intelligence (AI), and machine learning (ML) technologies is imperative to their mission. These technologies can significantly improve efficiency and effectiveness and drive innovation to serve citizens' needs better. Implementing HPC and AI solutions in government can bring challenges and pain points like fragmented datasets, computational hurdles when training ML models, and ethical implications of AI-driven decision-making. Still, CTG Federal, Dell Technologies, and NVIDIA unite to unlock new possibilities and seamlessly integrate HPC capabilities into existing enterprise architectures. This integration empowers organizations to glean actionable insights, improve decision-making, and gain a competitive edge across various domains, from supply chain optimization to financial modeling and beyond.
Download Now
Sponsored by CGT Federal
Whitepaper
Why IT Must Have an Influential Role in Strategic Decisions About Sustainability
Data centers are experiencing increasing power consumption, space constraints and cooling demands due to the unprecedented computing power required by today’s chips and servers. HVAC cooling systems consume approximately 40% of a data center’s electricity. These systems traditionally use air conditioning, air handling and fans to cool the data center facility and IT equipment, ultimately resulting in high energy consumption and high carbon emissions. Data centers are moving to direct liquid cooled (DLC) systems to improve cooling efficiency thus lowering their PUE, operating expenses (OPEX) and carbon footprint.
This paper describes how CoolIT Systems (CoolIT) meets the need for improved energy efficiency in data centers and includes case studies that show how CoolIT’s DLC solutions improve energy efficiency, increase rack density, lower OPEX, and enable sustainability programs. CoolIT is the global market and innovation leader in scalable DLC solutions for the world’s most demanding computing environments. CoolIT’s end-to-end solutions meet the rising demand in cooling and the rising demand for energy efficiency.
Download Now
Sponsored by Lenovo
Advanced Scale Career Development & Workforce Enhancement Center
Featured Advanced Scale Jobs:
HPCwire Resource Library
HPCwire Product Showcase
© 2024 HPCwire. All Rights Reserved. A Tabor Communications Publication
HPCwire is a registered trademark of Tabor Communications, Inc. Use of this site is governed by our Terms of Use and Privacy Policy.
Reproduction in whole or in part in any form or medium without express written permission of Tabor Communications, Inc. is prohibited.