AMD Shows Off MI300 Chip for the First Time

January 5, 2023

At the tail end of AMD’s 75-minute CES keynote, held yesterday in Las Vegas and via livestream, CEO Lisa Su shared new details of the forthcoming MI300 chip and publicly unveiled the silicon. The MI300 (teased earlier this year) is the first to combine a CPU, GPU and memory into a single integrated design, incorporating nine 5nm chiplets that are 3D stacked on top of four 6nm chiplets with 128 gigabytes of HBM3 memory.  Read more…

Top500: Exascale Is Officially Here with Debut of Frontier

May 30, 2022

The 59th installment of the Top500 list, issued today from ISC 2022 in Hamburg, Germany, officially marks a new era in supercomputing with the debut of the first-ever exascale system on the list. Frontier, deployed at the Department of Energy’s Oak Ridge National Laboratory, achieved 1.102 exaflops in its fastest High Performance Linpack run, which was completed... Read more…

AMD Milan-X CPU with 3D V-Cache Available in Four SKUs, Up to 64-Cores

March 21, 2022

Following their debut launch in November, AMD Epyc processors with 3D V-Cache technology, codenamed Milan-X, are now generally available from major system-makers as well as from cloud provider Microsoft Azure. Available in four SKUs and ranging from 16- to  64-cores, the new processors feature 768 megabytes of L3 cache... Read more…

AMD Launches Milan-X CPU with 3D V-Cache and Multichip Instinct MI200 GPU

November 8, 2021

At a virtual event this morning, AMD CEO Lisa Su unveiled the company’s latest and much-anticipated server products: the new Milan-X CPU, which leverages AMD’s new 3D V-Cache technology; and its new Instinct MI200 GPU, which provides up to 220 compute units across two Infinity Fabric-connected dies, delivering an astounding 47.9 peak double-precision teraflops. “We're in a high-performance... Read more…

AMD Introduces 3D Chiplets, Demos Vertical Cache on Zen 3 CPUs

June 2, 2021

At Computex 2021, held virtually this week, AMD showcased a new 3D chiplet architecture that will be used for future high-performance computing products set to Read more…

Intel Launches 10nm ‘Ice Lake’ Datacenter CPU with Up to 40 Cores

April 6, 2021

The wait is over. Today Intel officially launched its 10nm datacenter CPU, the third-generation Intel Xeon Scalable processor, codenamed Ice Lake. With up to 40 Read more…

AMD Launches Epyc ‘Milan’ with 19 SKUs for HPC, Enterprise and Hyperscale

March 15, 2021

At a virtual launch event held today (Monday), AMD revealed its third-generation Epyc “Milan” CPU lineup: a set of 19 SKUs -- including the flagship 64-core, 280-watt 7763 part --  aimed at HPC, enterprise and cloud workloads. Notably, the third-gen Epyc Milan chips achieve 19 percent... Read more…

AMD’s Q1 Sets Records and Meets Expectations, but COVID-19 Looms

April 29, 2020

AMD has reported its Q1 2020 revenue, slightly outperforming analyst expectations and dodging the first financial blows of COVID-19 to deliver $1.79 billion – a whopping 40 percent year-over-year growth in revenue, and a record for first-quarter earnings. The year-over-year growth was primarily driven by the computing and graphics segment... Read more…

  • arrow
  • Click Here for More Headlines
  • arrow

Whitepaper

Why IT Must Have an Influential Role in Strategic Decisions About Sustainability

In this era, expansion in digital infrastructure capacity is inevitable. Parallel to this, climate change consciousness is also rising, making sustainability a mandatory part of the organization’s functioning. As computing workloads such as AI and HPC continue to surge, so does the energy consumption, posing environmental woes. IT departments within organizations have a crucial role in combating this challenge. They can significantly drive sustainable practices by influencing newer technologies and process adoption that aid in mitigating the effects of climate change.

While buying more sustainable IT solutions is an option, partnering with IT solutions providers, such and Lenovo and Intel, who are committed to sustainability and aiding customers in executing sustainability strategies is likely to be more impactful.

Learn how Lenovo and Intel, through their partnership, are strongly positioned to address this need with their innovations driving energy efficiency and environmental stewardship.

Download Now

Sponsored by Lenovo

Whitepaper

How Direct Liquid Cooling Improves Data Center Energy Efficiency

Data centers are experiencing increasing power consumption, space constraints and cooling demands due to the unprecedented computing power required by today’s chips and servers. HVAC cooling systems consume approximately 40% of a data center’s electricity. These systems traditionally use air conditioning, air handling and fans to cool the data center facility and IT equipment, ultimately resulting in high energy consumption and high carbon emissions. Data centers are moving to direct liquid cooled (DLC) systems to improve cooling efficiency thus lowering their PUE, operating expenses (OPEX) and carbon footprint.

This paper describes how CoolIT Systems (CoolIT) meets the need for improved energy efficiency in data centers and includes case studies that show how CoolIT’s DLC solutions improve energy efficiency, increase rack density, lower OPEX, and enable sustainability programs. CoolIT is the global market and innovation leader in scalable DLC solutions for the world’s most demanding computing environments. CoolIT’s end-to-end solutions meet the rising demand in cooling and the rising demand for energy efficiency.

Download Now

Sponsored by CoolIT

Advanced Scale Career Development & Workforce Enhancement Center

Featured Advanced Scale Jobs:

SUBSCRIBE for monthly job listings and articles on HPC careers.

HPCwire Resource Library

HPCwire Product Showcase

Subscribe to the Monthly
Technology Product Showcase:

HPCwire