September 13, 2023
MLCommons this week issued the results of its latest MLPerf Inference (v3.1) benchmark exercise. Nvidia was again the top performing accelerator, but Intel (Xeo Read more…
June 28, 2023
As promised, MLCommons added a large language model (based on GPT-3) to its MLPerf training suite (v3.0) and released the latest round of results yesterday. Onl Read more…
April 5, 2023
MLCommons today released the latest MLPerf Inferencing (v3.0) results for the datacenter and edge. While Nvidia continues to dominate the results – topping al Read more…
November 14, 2022
MLCommons last week issued its third annual set of MLPerf HPC (v2.0) results intended to showcase the performance of larger systems when training more rigorous Read more…
November 10, 2022
MLCommons yesterday issued its latest round of MLPerf benchmarks – for Training, HPC, and Tiny. Releasing three sets of benchmarks at the same time makes pars Read more…
June 29, 2022
MLCommons’ latest MLPerf Training results (v2.0) issued today are broadly similar to v1.1 released last December. Nvidia still dominates, but less so (no gran Read more…
April 6, 2022
MLCommons today released its latest MLPerf inferencing results, with another strong showing by Nvidia accelerators inside a diverse array of systems. Roughly fo Read more…
November 19, 2021
Earlier this week MLCommons issued results from its latest MLPerf HPC training benchmarking exercise. Unlike other MLPerf benchmarks, which mostly measure the t Read more…
Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC processing generate excessive heat which results in higher data center power consumption and additional data center costs.
Data centers traditionally use air cooling solutions including heatsinks and fans that may not be able to reduce energy consumption while maintaining infrastructure performance for AI and HPC workloads. Liquid cooled systems will be increasingly replacing air cooled solutions for data centers running HPC and AI workloads to meet heat and performance needs.
QCT worked with Intel to develop the QCT QoolRack, a rack-level direct-to-chip cooling solution which meets data center needs with impressive cooling power savings per rack over air cooled solutions, and reduces data centers’ carbon footprint with QCT QoolRack smart management.
© 2023 HPCwire. All Rights Reserved. A Tabor Communications Publication
HPCwire is a registered trademark of Tabor Communications, Inc. Use of this site is governed by our Terms of Use and Privacy Policy.
Reproduction in whole or in part in any form or medium without express written permission of Tabor Communications, Inc. is prohibited.