October 19, 2023
It is safe to say that ARM isn't a scrappy startup that was once the pride of the UK. The US-based IPO made the chip designer a big-game chip player, and the Read more…
October 4, 2023
The configuration of Europe's first exascale supercomputer, Jupiter, has been finalized, and it is a win for Nvidia and a disappointment for x86 chip vendors In Read more…
September 28, 2023
As HPCwire reported recently, the latest MLperf benchmarks are out. Not unsurprisingly, Nvidia was the leader across many categories. The HGX H100 GPU systems, which contain eight H100 GPUs, delivered the highest throughput on every MLPerf inference test in this round. Read more…
August 9, 2023
Nvidia Grace-Hopper offers a tightly integrated CPU + GPU solution for what is becoming a generative AI dominated market. To increase performance, the graphics Read more…
November 5, 2022
Arm's been riding high on the mobile market for decades now, but has struggled to make its mark on servers. But the company hopes to reverse that with some new initiatives that Arm executives addressed at the recent Arm DevSummit held last week. The top initiative revolves around providing programming and design tools so its chip... Read more…
December 1, 2021
Three years after unveiling the first generation of its AWS Graviton chip-powered instances in 2018, Amazon Web Services announced that the third generation of the processors – the AWS Graviton3 – will power all-new Amazon Elastic Compute 2 (EC2) C7g instances that are now available in preview. Debuting at the AWS re:Invent 2021... Read more…
August 25, 2021
The emergence of data processing units (DPU) and infrastructure processing units (IPU) as potentially important pieces in cloud and datacenter architectures was Read more…
April 27, 2021
Chip designer Arm Holdings is sharing details about its Neoverse V1 and N2 cores, introducing its new CMN-700 interconnect, and showcasing its partners' plans t Read more…
Making the Most of Today’s Cloud-First Approach to Running HPC and AI Workloads With Penguin Scyld Cloud Central™
Bursting to cloud has long been used to complement on-premises HPC capacity to meet variable compute demands. But in today’s age of cloud, many workloads start on the cloud with little IT or corporate oversight. What is needed is a way to operationalize the use of these cloud resources so that users get the compute power they need when they need it, but with constraints that take costs and the efficient use of existing compute power into account. Download this special report to learn more about this topic.
Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC processing generate excessive heat which results in higher data center power consumption and additional data center costs.
Data centers traditionally use air cooling solutions including heatsinks and fans that may not be able to reduce energy consumption while maintaining infrastructure performance for AI and HPC workloads. Liquid cooled systems will be increasingly replacing air cooled solutions for data centers running HPC and AI workloads to meet heat and performance needs.
QCT worked with Intel to develop the QCT QoolRack, a rack-level direct-to-chip cooling solution which meets data center needs with impressive cooling power savings per rack over air cooled solutions, and reduces data centers’ carbon footprint with QCT QoolRack smart management.
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