April 26, 2013
Last week Mellanox debuted a new network adapter, ConnectX-3 Pro, the first interconnect solution to feature cloud offload engines for overlay networks. Like its predecessor, ConnectX-3, it supports both 10/40 Gigabit Ethernet as well as 56Gb/s InfiniBand, but it's the overlay offloading engine that is poised to unlock cloud's potential. Read more…
July 26, 2011
It was a bit of a surprise when QLogic beat out Mellanox as the interconnect vendor on the NNSA's Tri-Lab Linux Capacity Cluster 2 contract. Not only was Mellanox the incumbent on the original Tri-Lab contract, but it is widely considered to have the more complete solution set for InfiniBand. Nevertheless, QLogic managed to win the day, and did so with somewhat unconventional technologies. Read more…
Making the Most of Today’s Cloud-First Approach to Running HPC and AI Workloads With Penguin Scyld Cloud Central™
Bursting to cloud has long been used to complement on-premises HPC capacity to meet variable compute demands. But in today’s age of cloud, many workloads start on the cloud with little IT or corporate oversight. What is needed is a way to operationalize the use of these cloud resources so that users get the compute power they need when they need it, but with constraints that take costs and the efficient use of existing compute power into account. Download this special report to learn more about this topic.
Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC processing generate excessive heat which results in higher data center power consumption and additional data center costs.
Data centers traditionally use air cooling solutions including heatsinks and fans that may not be able to reduce energy consumption while maintaining infrastructure performance for AI and HPC workloads. Liquid cooled systems will be increasingly replacing air cooled solutions for data centers running HPC and AI workloads to meet heat and performance needs.
QCT worked with Intel to develop the QCT QoolRack, a rack-level direct-to-chip cooling solution which meets data center needs with impressive cooling power savings per rack over air cooled solutions, and reduces data centers’ carbon footprint with QCT QoolRack smart management.
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