In this week’s hand-picked assortment, researchers consider integrating grid and cloud infrastructures, explore building secure governance clouds, and review HPC scheduling systems in grid and cloud environments.
<img style=”float: left;” src=”http://media2.hpcwire.com/hpcwire/Intel_fabric_controller.bmp” alt=”” width=”117″ height=”59″ />It’s been a good year for interconnect maker Mellanox. The company has been riding high in 2012, thanks in large part to its dominant position in the InfiniBand marketplace and the surge in FDR sales over the last several months. But with Intel now eyeing the lucrative high performance interconnect market, Mellanox may soon face a formidable challenge as InfiniBand kingpin.
<img style=”float: left;” src=”http://media2.hpcwire.com/hpcwire/computer_chips_on_die_small.jpg” alt=”” width=”94″ height=”85″ />Intel has begun to formulate a strategy that will integrate fabric controllers with its server processors. According to Raj Hazra, general manager of the Technical Computing unit at Intel, the company is planning to use the recently acquired IP from Cray, QLogic and Fulcrum to deliver chips that put what is essentially a NIC onto the processor die. In a recent conversation with Hazra, he outlined their new fabric interconnect strategy.
Researchers at University of California, Riverside have come up with a new architecture to efficiently address the challenges of high-speed networks. In a paper to be presented at the IEEE International Symposium High-Performance, the researchers outline a novel on-chip network engine, known as NEngine.
Russian supercomputer maker T-Platforms is continuing its push into the elite end of the HPC market. On Monday, the company announced a joint venture with a group at the University of Heidelberg to develop a new ultra-fast interconnect for high-end supercomputing. The goal is to bring the technology to market in the form of an ASIC, which can be incorporated into a network interface controller for HPC servers.