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Semiconductor Companies Create Building Block for Chiplet Design
January 24, 2023
Intel's CEO Pat Gelsinger last week made a grand proclamation that chips will be for the next few decades what oil and gas was to the world over the last 50 years. While that remains to be seen, two technology associations are joining hands to develop building blocks to stabilize the development of future chip designs. The goal of the standard is to set the stage for a thriving marketplace that fuels... Read more…
Blueprints to Shake up Next-generation Server Designs Emerge at OCP Summit
October 24, 2022
A new generation of designs ready to shake up conventional server architecture emerged at the recent Open Compute Project Summit, where Google, Facebook and Mic Read more…
Penguin Computing Brings Cascade Lake-AP to OCP Form Factor
July 7, 2020
Penguin Computing, a subsidiary of SMART Global Holdings, Inc., announced yesterday (July 6) a new Tundra server, Tundra AP, that is the first to implement the Read more…
Inspur Takes OCP Beyond Hyperscalers
May 12, 2020
Inspur, China’s server leader, is expanding its AI offerings based on Open Compute Project specifications, including an OCP “cloud optimized” server geare Read more…
Chiplet Effort Advances for Workload Acceleration
September 27, 2019
Chiplet-based designs, so called because they combine multiple components into a single package, are increasingly seen as addressing the inability of general-pu Read more…
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Whitepaper
QCT QoolRack: An Optimized Liquid Cooling Solution for HPC/AI Workloads
Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC processing generate excessive heat which results in higher data center power consumption and additional data center costs.
Data centers traditionally use air cooling solutions including heatsinks and fans that may not be able to reduce energy consumption while maintaining infrastructure performance for AI and HPC workloads. Liquid cooled systems will be increasingly replacing air cooled solutions for data centers running HPC and AI workloads to meet heat and performance needs.
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