January 24, 2023
Intel's CEO Pat Gelsinger last week made a grand proclamation that chips will be for the next few decades what oil and gas was to the world over the last 50 years. While that remains to be seen, two technology associations are joining hands to develop building blocks to stabilize the development of future chip designs. The goal of the standard is to set the stage for a thriving marketplace that fuels... Read more…
October 24, 2022
A new generation of designs ready to shake up conventional server architecture emerged at the recent Open Compute Project Summit, where Google, Facebook and Mic Read more…
July 7, 2020
Penguin Computing, a subsidiary of SMART Global Holdings, Inc., announced yesterday (July 6) a new Tundra server, Tundra AP, that is the first to implement the Read more…
Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC processing generate excessive heat which results in higher data center power consumption and additional data center costs.
Data centers traditionally use air cooling solutions including heatsinks and fans that may not be able to reduce energy consumption while maintaining infrastructure performance for AI and HPC workloads. Liquid cooled systems will be increasingly replacing air cooled solutions for data centers running HPC and AI workloads to meet heat and performance needs.
QCT worked with Intel to develop the QCT QoolRack, a rack-level direct-to-chip cooling solution which meets data center needs with impressive cooling power savings per rack over air cooled solutions, and reduces data centers’ carbon footprint with QCT QoolRack smart management.
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