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Intel Says UCIe to Outpace PCIe in Speed Race

May 11, 2022

Intel has shared more details on a new interconnect that is the foundation of the company’s long-term plan for x86, Arm and RISC-V architectures to co-exist in a single chip package. The semiconductor company is taking a modular approach to chip design with the option for customers to cram computing blocks such as CPUs, GPUs and AI accelerators inside a single chip package. Read more…

Industry Consortium Forms to Drive UCIe Chiplet Interconnect Standard

March 2, 2022

A new industry consortium aims to establish a die-to-die interconnect standard – Universal Chiplet Interconnect Express (UCIe) – in support of an open chipl Read more…

OpenCAPI Takes on PCIe, Vows 10X Improvement

October 14, 2016

With two major announcements this week, IBM continues to drive the build-out of its advanced scale ecosystem, aligning industry heavies to jointly develop open technologies that tackle the perennial problems of latency, bandwidth and bringing processing power into balance with data access within and among servers. In so doing, IBM and the companies alongside it have joined battle with Intel Read more…

The Promise and Progress of NVM Express

October 29, 2015

The high-performance computing community has started to take notice of Non-Volatile Memory Express (NVMe) technology. This communications interface and protoc Read more…

ISC Session Preview: I/O in the Post-Petascale Era

June 23, 2015

Improving data communication performance in HPC has turned out to be one of the most difficult challenges for system designers. As a result, the topic is gettin Read more…

PLX Looks to Bring PCIe Fabric to Market

November 14, 2012

PLX Technology, a maker of PCIe switches and bridges, has been spreading the word about using PCIe as a general-purpose HPC interconnect. At SC12 this week, the company went a little further down that path, unveiling their upcoming Express Fabric technology. We asked Vijay Meduri, executive vice president of engineering at PLX to talk about the rationale of using PCIe as an interconnect fabric. Read more…

Texas Memory Systems Pushes SSD Envelope

May 18, 2011

Enterprise SSD maker Texas Memory Systems (TMS) has been kicking up some dust lately, announcing record-breaking performance results with its RamSan-630 product and launching its latest PCIe flash offering. Specifically, TMS recently put up some rather impressive numbers in two key benchmarks established by the Storage Performance Council. And then this week, the company introduced its next-generation PCIe flash memory product, the RamSan-70. Read more…

A Case for PCI Express as a High-Performance Cluster Interconnect

January 24, 2011

In high-speed computing (HPC), there are a number of significant benefits to simplifying the processor interconnect in rack- and chassis-based servers by designing in PCI Express (PCIe). The PCI-SIG, the group responsible for the conventional PCI and the much-higher-performance PCIe standards, has released three generations of PCIe specifications over the last eight years and is fully expected to continue this progression in the future with even newer generations, from which HPC systems will continue to see newer features, faster data throughput and improved reliability. Read more…

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Whitepaper

A New Standard in CAE Solutions for Manufacturing

Today, manufacturers of all sizes face many challenges. Not only do they need to deliver complex products quickly, they must do so with limited resources while continuously innovating and improving product quality. With the use of computer-aided engineering (CAE), engineers can design and test ideas for new products without having to physically build many expensive prototypes. This helps lower costs, enhance productivity, improve quality, and reduce time to market.

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Sponsored by HPE

Whitepaper

Porting CUDA Applications to Run on AMD GPUs

A workload-driven system capable of running HPC/AI workloads is more important than ever. Organizations face many challenges when building a system capable of running HPC and AI workloads. There are also many complexities in system design and integration. Building a workload driven solution requires expertise and domain knowledge that organizational staff may not possess.

This paper describes how Quanta Cloud Technology (QCT), a long-time Intel® partner, developed the Taiwania 2 and Taiwania 3 supercomputers to meet the research needs of the Taiwan’s academic, industrial, and enterprise users. The Taiwan National Center for High-Performance Computing (NCHC) selected QCT for their expertise in building HPC/AI supercomputers and providing worldwide end-to-end support for solutions from system design, through integration, benchmarking and installation for end users and system integrators to ensure customer success.

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