GigaIO’s New SuperNODE Takes-off with Record Breaking AMD GPU Performance 

August 10, 2023

The HPC users dream is to keep stuffing GPUs into a rack mount box and make everything go faster. Some servers offer up to eight GPUs, but the standard server u Read more…

PCIe Market to Hit $50B; PCIe 7.0 v 0.3 Now Available

June 13, 2023

Steady technical progress and continued market traction were key points of emphasis coming from the PCI-SIG Developers Conference held this week in Santa Clara. Read more…

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Intel Says UCIe to Outpace PCIe in Speed Race

May 11, 2022

Intel has shared more details on a new interconnect that is the foundation of the company’s long-term plan for x86, Arm and RISC-V architectures to co-exist in a single chip package. The semiconductor company is taking a modular approach to chip design with the option for customers to cram computing blocks such as CPUs, GPUs and AI accelerators inside a single chip package. Read more…

Industry Consortium Forms to Drive UCIe Chiplet Interconnect Standard

March 2, 2022

A new industry consortium aims to establish a die-to-die interconnect standard – Universal Chiplet Interconnect Express (UCIe) – in support of an open chipl Read more…

OpenCAPI Takes on PCIe, Vows 10X Improvement

October 14, 2016

With two major announcements this week, IBM continues to drive the build-out of its advanced scale ecosystem, aligning industry heavies to jointly develop open technologies that tackle the perennial problems of latency, bandwidth and bringing processing power into balance with data access within and among servers. In so doing, IBM and the companies alongside it have joined battle with Intel Read more…

The Promise and Progress of NVM Express

October 29, 2015

The high-performance computing community has started to take notice of Non-Volatile Memory Express (NVMe) technology. This communications interface and protoc Read more…

ISC Session Preview: I/O in the Post-Petascale Era

June 23, 2015

Improving data communication performance in HPC has turned out to be one of the most difficult challenges for system designers. As a result, the topic is gettin Read more…

PLX Looks to Bring PCIe Fabric to Market

November 14, 2012

PLX Technology, a maker of PCIe switches and bridges, has been spreading the word about using PCIe as a general-purpose HPC interconnect. At SC12 this week, the company went a little further down that path, unveiling their upcoming Express Fabric technology. We asked Vijay Meduri, executive vice president of engineering at PLX to talk about the rationale of using PCIe as an interconnect fabric. Read more…

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In this era, expansion in digital infrastructure capacity is inevitable. Parallel to this, climate change consciousness is also rising, making sustainability a mandatory part of the organization’s functioning. As computing workloads such as AI and HPC continue to surge, so does the energy consumption, posing environmental woes. IT departments within organizations have a crucial role in combating this challenge. They can significantly drive sustainable practices by influencing newer technologies and process adoption that aid in mitigating the effects of climate change.

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How Direct Liquid Cooling Improves Data Center Energy Efficiency

Data centers are experiencing increasing power consumption, space constraints and cooling demands due to the unprecedented computing power required by today’s chips and servers. HVAC cooling systems consume approximately 40% of a data center’s electricity. These systems traditionally use air conditioning, air handling and fans to cool the data center facility and IT equipment, ultimately resulting in high energy consumption and high carbon emissions. Data centers are moving to direct liquid cooled (DLC) systems to improve cooling efficiency thus lowering their PUE, operating expenses (OPEX) and carbon footprint.

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