FPGA-Based Genome Processor Bundles Storage

January 6, 2017

Bio-processor developer Edico Genome is collaborating with storage specialist Dell EMC to bundle computing and storage for analyzing gene-sequencing data. Th Read more…

Texas Instruments Puts ARM-DSP Processors Into Play for HPC

November 20, 2012

NVIDIA, Intel and AMD were not the only chip vendors unveiling new HPC accelerators last week SC12. Texas Instruments (TI) announced a set of heterogeneous processors that they believe will offer among the best performance per watt in the industry. In this case, the chipmaker glued an ARM CPU and DSP together on the same die, offering a low-power SoC with an impressive number of FLOPS. Read more…

AMD Brings New 16-Core Opterons to Market

November 5, 2012

Chipmaker unveils Opteron 6300 series -- same core count, more performance. Read more…

Adapteva Launches Crowd-Source Funding for Its Floating Point Accelerator

September 28, 2012

Chipmaker Adapteva is attempting to bypass the conventional venture capital funding route and collect money via a micro-investor platform known as Kickstarter. In the process, the company will open up its software and hardware design for its manycore Epiphany architecture, and deliver a parallel computing kit to anyone who can ante up $99. Read more…

GLOBALFOUNDRIES to Challenge Intel at 14nm

September 24, 2012

Chip manufacturer plans to offer 14nm FinFET transistors in 2014. Read more…

Intel Weaves Strategy To Put Interconnect Fabrics On Chip

September 10, 2012

Intel has begun to formulate a strategy that will integrate fabric controllers with its server processors. According to Raj Hazra, general manager of the Technical Computing unit at Intel, the company is planning to use the recently acquired IP from Cray, QLogic and Fulcrum to deliver chips that put what is essentially a NIC onto the processor die. In a recent conversation with Hazra, he outlined their new fabric interconnect strategy. Read more…

Adapteva Unveils 64-Core Chip

August 22, 2012

Chipmaker Adapteva is sampling its 4th-generation multicore processor, known as Epiphany-IV. The 64-core chip delivers a peak performance of 100 gigaflops and draws just two watts of power, yielding a stunning 50 gigaflops/watt. The engineering samples were manufactured by GLOBALFOUNDRIES on its latest 28nm process technology. Read more…

Analyst Weighs In on 64-Bit ARM

August 16, 2012

In a recent report in Real World Technologies, chip guru David Kanter dissects the new 64-bit ARM design and what it might mean to the IT landscape. His take on the architecture is almost uniformly positive, noting that not only did the designers manage to develop an elegant instruction set that was backwardly compatible with the existing ISA, but they also took the extra step to jettison a few of the poorly designed features of the 32-bit architecture. Read more…

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Why IT Must Have an Influential Role in Strategic Decisions About Sustainability

In this era, expansion in digital infrastructure capacity is inevitable. Parallel to this, climate change consciousness is also rising, making sustainability a mandatory part of the organization’s functioning. As computing workloads such as AI and HPC continue to surge, so does the energy consumption, posing environmental woes. IT departments within organizations have a crucial role in combating this challenge. They can significantly drive sustainable practices by influencing newer technologies and process adoption that aid in mitigating the effects of climate change.

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How Direct Liquid Cooling Improves Data Center Energy Efficiency

Data centers are experiencing increasing power consumption, space constraints and cooling demands due to the unprecedented computing power required by today’s chips and servers. HVAC cooling systems consume approximately 40% of a data center’s electricity. These systems traditionally use air conditioning, air handling and fans to cool the data center facility and IT equipment, ultimately resulting in high energy consumption and high carbon emissions. Data centers are moving to direct liquid cooled (DLC) systems to improve cooling efficiency thus lowering their PUE, operating expenses (OPEX) and carbon footprint.

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