July 11, 2022
The supply chain for chips, already extraordinarily fraught with logistical and geopolitical impediments, is about to face another. According to a report from t Read more…
May 6, 2021
IBM Research today announced the successful prototyping of the world's first 2 nanometer chip, fabricated with silicon nanosheet technology on a standard 300mm Read more…
February 17, 2021
Samsung today announced what it’s calling the industry’s first high bandwidth memory (HBM) memory with built-in AI processing capability. The new device – Read more…
May 10, 2020
The Trump administration is in talks with Intel and TSMC to spur development of new chip factories in the U.S. according to a report in the Wall Street Journal Read more…
January 14, 2020
The dizzying pace of technology innovation often fueled by the growing availability of computing horsepower is underscored by the race to develop unique designs Read more…
January 28, 2013
ARM chips are moving beyond the mobile device market and into the datacenter. A series of announcements in 2012 point to the enormous interest in the low-power chip architecture. So far, however, customers are just evaluating the business. 2013 will show how well ARM can compete... Read more…
January 17, 2013
The next-generation memory-maker Micron Technology was one of the many innovative companies demonstrating its wares on the Supercomputing Conference (SC12) show floor last November. Micron's General Manager of Hybrid Technology Scott Graham was on hand to discuss the latest developments in their Hybrid Memory Cube (HMC) technology, a multi-chip module that aims to address one of the biggest challenges in high performance computing: scaling the memory wall. Read more…
November 20, 2012
ARM-based CPU-GPU processor designed for mobile devices makes HPC debut. Read more…
As Federal agencies navigate an increasingly complex and data-driven world, learning how to get the most out of high-performance computing (HPC), artificial intelligence (AI), and machine learning (ML) technologies is imperative to their mission. These technologies can significantly improve efficiency and effectiveness and drive innovation to serve citizens' needs better. Implementing HPC and AI solutions in government can bring challenges and pain points like fragmented datasets, computational hurdles when training ML models, and ethical implications of AI-driven decision-making. Still, CTG Federal, Dell Technologies, and NVIDIA unite to unlock new possibilities and seamlessly integrate HPC capabilities into existing enterprise architectures. This integration empowers organizations to glean actionable insights, improve decision-making, and gain a competitive edge across various domains, from supply chain optimization to financial modeling and beyond.
Data centers are experiencing increasing power consumption, space constraints and cooling demands due to the unprecedented computing power required by today’s chips and servers. HVAC cooling systems consume approximately 40% of a data center’s electricity. These systems traditionally use air conditioning, air handling and fans to cool the data center facility and IT equipment, ultimately resulting in high energy consumption and high carbon emissions. Data centers are moving to direct liquid cooled (DLC) systems to improve cooling efficiency thus lowering their PUE, operating expenses (OPEX) and carbon footprint.
This paper describes how CoolIT Systems (CoolIT) meets the need for improved energy efficiency in data centers and includes case studies that show how CoolIT’s DLC solutions improve energy efficiency, increase rack density, lower OPEX, and enable sustainability programs. CoolIT is the global market and innovation leader in scalable DLC solutions for the world’s most demanding computing environments. CoolIT’s end-to-end solutions meet the rising demand in cooling and the rising demand for energy efficiency.
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