February 24, 2022
Technology heavyweight Hewlett Packard Enterprise and optical IO startup Ayar Labs have embarked on a strategic collaboration to advance silicon photonics in the datacenter and integrate optical IO into a future generation of HPE’s Slingshot interconnect. Optical-based interconnects are essential to overcoming the bandwidth, latency, power and distance... Read more…
August 7, 2018
Researchers at the National Institute of Standards and Technology (NIST) have made a silicon chip that distributes optical signals precisely across a miniature Read more…
December 4, 2017
GlobalFoundries (GF) and Ayar Labs, a startup focused on using light, instead of electricity, to transfer data between chips, today announced they've entered in Read more…
March 22, 2016
At the Optical Fiber Conference taking place from March 22-24 in Anaheim, Calif., Mellanox is announcing an "important milestone" on the road to High Data Rate (HDR) 200Gb/s InfiniBand and Ethernet networks. At the trade show, the company is demonstrating 50 Gb/s silicon photonics optical modulators and detectors, which will comprise key elements of 200 Gb/s and 400 Gb/s LinkX cables and transceivers. Read more…
January 17, 2013
Technology will enable decoupling of compute and storage in server racks. Read more…
Making the Most of Today’s Cloud-First Approach to Running HPC and AI Workloads With Penguin Scyld Cloud Central™
Bursting to cloud has long been used to complement on-premises HPC capacity to meet variable compute demands. But in today’s age of cloud, many workloads start on the cloud with little IT or corporate oversight. What is needed is a way to operationalize the use of these cloud resources so that users get the compute power they need when they need it, but with constraints that take costs and the efficient use of existing compute power into account. Download this special report to learn more about this topic.
Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC processing generate excessive heat which results in higher data center power consumption and additional data center costs.
Data centers traditionally use air cooling solutions including heatsinks and fans that may not be able to reduce energy consumption while maintaining infrastructure performance for AI and HPC workloads. Liquid cooled systems will be increasingly replacing air cooled solutions for data centers running HPC and AI workloads to meet heat and performance needs.
QCT worked with Intel to develop the QCT QoolRack, a rack-level direct-to-chip cooling solution which meets data center needs with impressive cooling power savings per rack over air cooled solutions, and reduces data centers’ carbon footprint with QCT QoolRack smart management.
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