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Micron Readies Hybrid Memory Cube for Debut

Jan 17, 2013 |

<img style=”float: left;” src=”http://media2.hpcwire.com/hpcwire/HMC_side_view_SC12_small.jpg” alt=”” width=”95″ height=”85″ />The next-generation memory-maker Micron Technology was one of the many innovative companies demonstrating its wares on the Supercomputing Conference (SC12) show floor last November. Micron’s General Manager of Hybrid Technology Scott Graham was on hand to discuss the latest developments in their Hybrid Memory Cube (HMC) technology, a multi-chip module that aims to address one of the biggest challenges in high performance computing: scaling the memory wall.

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