November 20, 2012
NVIDIA, Intel and AMD were not the only chip vendors unveiling new HPC accelerators last week SC12. Texas Instruments (TI) announced a set of heterogeneous processors that they believe will offer among the best performance per watt in the industry. In this case, the chipmaker glued an ARM CPU and DSP together on the same die, offering a low-power SoC with an impressive number of FLOPS. Read more…
January 17, 2012
Whether you're talking about high performance computers, enterprise servers, or mobile devices, the two biggest impediments to application performance in computing today are the memory wall and the power wall. Venray Technology is aiming to knock down those walls with a unique approach that puts CPU cores and DRAM on the same die. The company has been in semi-stealth mode since it inception seven years ago, but is now trying to get the word out about its technology as it searches for a commercial buyer. Read more…
February 5, 2009
At the International Solid-State Circuits Conference next week, Intel will provide an in-depth look at Intel’s Nehalem architecture as well as the chip maker’s plans for new types of system-on-a-chip processors. Read more…
For many organizations, decisions about whether to run HPC workloads in the cloud or in on-premises datacenters are less all-encompassing and more about leveraging both infrastructures strategically to optimize HPC workloads across hybrid environments. From multi-clouds to on-premises, dark, edge, and point of presence (PoP) datacenters, data comes from all directions and in all forms while HPC workloads run in every dimension of modern datacenter schemes. HPC has become multi-dimensional and must be managed as such.
This white paper explores several of these new strategies and tools for optimizing HPC workloads across all dimensions to achieve breakthrough results in Microsoft Azure.
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