Datanami
EnterpriseAI
HPCwire Japan
QCwire
HPC & AI Wall Street
Intel Is GPU Poor – Dissecting the Company’s Disastrous Q2 Earnings
August 5, 2024
In an era of prosperity for chip makers, Intel is a titanic disappointment. There's no other way to put it. The company reported a second-quarter loss of $1.6 b Read more…
Repeating Manufacturing Mistakes Could Jeopardize Intel’s Fab Plans
July 29, 2022
Intel is welcoming new customers as it reimagines its future as a chip manufacturing powerhouse, but it will have to earn its stripes by proving it won't repeat past fabrication mistakes that put the company in a tailspin, analysts said. The chipmaker this week signed up Mediatek as a new customer for its factories... Read more…
Not Cool: Semiconductor Industry to Face Coolant Shortage
July 11, 2022
The supply chain for chips, already extraordinarily fraught with logistical and geopolitical impediments, is about to face another. According to a report from t Read more…
US Pushes for Expanded Ban on Sale of Chipmaking Equipment to China
July 8, 2022
The supply chain pressures created by the Covid-19 pandemic and the war in Ukraine are pushing nations into increasing conflict on the chipmaking front. Now, the U.S. is ratcheting up the stakes once again, reportedly working to stymie China’s expansion of its chipmaking capabilities by pressuring Dutch firm ASML from selling critical equipment to China. Read more…
Big Three Cloud Providers Halt New Business in Russia
March 10, 2022
Add Amazon Web Services to the growing list of companies (tech and otherwise) that are curtailing business with Russia in opposition to President Putin’s invasion of Ukraine. As reported in the New York Times and then by Amazon itself, Amazon Web Services is blocking new sign-ups from Russia and Belarus. Existing customers are not impacted. “We’ve suspended shipment of retail... Read more…
Graphcore Launches Wafer-on-Wafer ‘Bow’ IPU
March 3, 2022
Graphcore introduced its AI-focused, PCIe-based Intelligent Processing Units (IPUs) six years ago. Since then, the company has done anything but slow down, announcing a second generation of IPUs in 2020 and, over the years, larger and larger IPU-based “IPU-POD” systems — most recently the IPU-POD128 and the IPU-POD256, both announced just a few months... Read more…
Industry Consortium Forms to Drive UCIe Chiplet Interconnect Standard
March 2, 2022
A new industry consortium aims to establish a die-to-die interconnect standard – Universal Chiplet Interconnect Express (UCIe) – in support of an open chipl Read more…
AMD Chipmaker TSMC to Use AMD Chips for Chipmaking
May 8, 2021
TSMC has tapped AMD to support its major manufacturing and R&D workloads. AMD will provide its Epyc Rome 7702P CPUs – with 64 cores operating at a base cl Read more…
- Click Here for More Headlines
Leading Solution Providers
Whitepaper
From Hallucination to Reality
As Federal agencies navigate an increasingly complex and data-driven world, learning how to get the most out of high-performance computing (HPC), artificial intelligence (AI), and machine learning (ML) technologies is imperative to their mission. These technologies can significantly improve efficiency and effectiveness and drive innovation to serve citizens' needs better. Implementing HPC and AI solutions in government can bring challenges and pain points like fragmented datasets, computational hurdles when training ML models, and ethical implications of AI-driven decision-making. Still, CTG Federal, Dell Technologies, and NVIDIA unite to unlock new possibilities and seamlessly integrate HPC capabilities into existing enterprise architectures. This integration empowers organizations to glean actionable insights, improve decision-making, and gain a competitive edge across various domains, from supply chain optimization to financial modeling and beyond.
Download Now
Sponsored by CGT Federal
Whitepaper
Why IT Must Have an Influential Role in Strategic Decisions About Sustainability
Data centers are experiencing increasing power consumption, space constraints and cooling demands due to the unprecedented computing power required by today’s chips and servers. HVAC cooling systems consume approximately 40% of a data center’s electricity. These systems traditionally use air conditioning, air handling and fans to cool the data center facility and IT equipment, ultimately resulting in high energy consumption and high carbon emissions. Data centers are moving to direct liquid cooled (DLC) systems to improve cooling efficiency thus lowering their PUE, operating expenses (OPEX) and carbon footprint.
This paper describes how CoolIT Systems (CoolIT) meets the need for improved energy efficiency in data centers and includes case studies that show how CoolIT’s DLC solutions improve energy efficiency, increase rack density, lower OPEX, and enable sustainability programs. CoolIT is the global market and innovation leader in scalable DLC solutions for the world’s most demanding computing environments. CoolIT’s end-to-end solutions meet the rising demand in cooling and the rising demand for energy efficiency.
Download Now
Sponsored by Lenovo
Advanced Scale Career Development & Workforce Enhancement Center
Featured Advanced Scale Jobs:
HPCwire Resource Library
HPCwire Product Showcase
© 2024 HPCwire. All Rights Reserved. A Tabor Communications Publication
HPCwire is a registered trademark of Tabor Communications, Inc. Use of this site is governed by our Terms of Use and Privacy Policy.
Reproduction in whole or in part in any form or medium without express written permission of Tabor Communications, Inc. is prohibited.