Repeating Manufacturing Mistakes Could Jeopardize Intel’s Fab Plans

July 29, 2022

Intel is welcoming new customers as it reimagines its future as a chip manufacturing powerhouse, but it will have to earn its stripes by proving it won't repeat past fabrication mistakes that put the company in a tailspin, analysts said. The chipmaker this week signed up Mediatek as a new customer for its factories... Read more…

Not Cool: Semiconductor Industry to Face Coolant Shortage

July 11, 2022

The supply chain for chips, already extraordinarily fraught with logistical and geopolitical impediments, is about to face another. According to a report from t Read more…

US Pushes for Expanded Ban on Sale of Chipmaking Equipment to China

July 8, 2022

The supply chain pressures created by the Covid-19 pandemic and the war in Ukraine are pushing nations into increasing conflict on the chipmaking front. Now, the U.S. is ratcheting up the stakes once again, reportedly working to stymie China’s expansion of its chipmaking capabilities by pressuring Dutch firm ASML from selling critical equipment to China. Read more…

Big Three Cloud Providers Halt New Business in Russia

March 10, 2022

Add Amazon Web Services to the growing list of companies (tech and otherwise) that are curtailing business with Russia in opposition to President Putin’s invasion of Ukraine. As reported in the New York Times and then by Amazon itself, Amazon Web Services is blocking new sign-ups from Russia and Belarus. Existing customers are not impacted. “We’ve suspended shipment of retail... Read more…

Graphcore Launches Wafer-on-Wafer ‘Bow’ IPU

March 3, 2022

Graphcore introduced its AI-focused, PCIe-based Intelligent Processing Units (IPUs) six years ago. Since then, the company has done anything but slow down, announcing a second generation of IPUs in 2020 and, over the years, larger and larger IPU-based “IPU-POD” systems — most recently the IPU-POD128 and the IPU-POD256, both announced just a few months... Read more…

Industry Consortium Forms to Drive UCIe Chiplet Interconnect Standard

March 2, 2022

A new industry consortium aims to establish a die-to-die interconnect standard – Universal Chiplet Interconnect Express (UCIe) – in support of an open chipl Read more…

AMD Chipmaker TSMC to Use AMD Chips for Chipmaking

May 8, 2021

TSMC has tapped AMD to support its major manufacturing and R&D workloads. AMD will provide its Epyc Rome 7702P CPUs – with 64 cores operating at a base cl Read more…

  • arrow
  • Click Here for More Headlines
  • arrow

Whitepaper

How Direct Liquid Cooling Improves Data Center Energy Efficiency

Data centers are experiencing increasing power consumption, space constraints and cooling demands due to the unprecedented computing power required by today’s chips and servers. HVAC cooling systems consume approximately 40% of a data center’s electricity. These systems traditionally use air conditioning, air handling and fans to cool the data center facility and IT equipment, ultimately resulting in high energy consumption and high carbon emissions. Data centers are moving to direct liquid cooled (DLC) systems to improve cooling efficiency thus lowering their PUE, operating expenses (OPEX) and carbon footprint.

This paper describes how CoolIT Systems (CoolIT) meets the need for improved energy efficiency in data centers and includes case studies that show how CoolIT’s DLC solutions improve energy efficiency, increase rack density, lower OPEX, and enable sustainability programs. CoolIT is the global market and innovation leader in scalable DLC solutions for the world’s most demanding computing environments. CoolIT’s end-to-end solutions meet the rising demand in cooling and the rising demand for energy efficiency.

Download Now

Sponsored by CoolIT

Whitepaper

Transforming Industrial and Automotive Manufacturing

Divergent Technologies developed a digital production system that can revolutionize automotive and industrial scale manufacturing. Divergent uses new manufacturing solutions and their Divergent Adaptive Production System (DAPS™) software to make vehicle manufacturing more efficient, less costly and decrease manufacturing waste by replacing existing design and production processes.

Divergent initially used on-premises workstations to run HPC simulations but faced challenges because their workstations could not achieve fast enough simulation times. Divergent also needed to free staff from managing the HPC system, CAE integration and IT update tasks.

Download Now

Sponsored by TotalCAE

Advanced Scale Career Development & Workforce Enhancement Center

Featured Advanced Scale Jobs:

SUBSCRIBE for monthly job listings and articles on HPC careers.

HPCwire Resource Library

HPCwire Product Showcase

Subscribe to the Monthly
Technology Product Showcase:

HPCwire