For the First Time, UCIe Shares Bandwidth Speeds Between Chiplets

June 7, 2023

The first numbers of the available bandwidth between chiplets is out – UCIe is estimating that chiplet packages could squeeze out communication speeds of 630Gbps, or 0.63Tbps, in a very tight area. That number was shared by the Universal Chiplet Interconnect Express consortium last month... Read more…

UCIe Consortium Incorporates, Nvidia and Alibaba Round Out Board

August 2, 2022

The Universal Chiplet Interconnect Express (UCIe) consortium is moving ahead with its effort to standardize a universal interconnect at the package level. The c Read more…

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Intel Says UCIe to Outpace PCIe in Speed Race

May 11, 2022

Intel has shared more details on a new interconnect that is the foundation of the company’s long-term plan for x86, Arm and RISC-V architectures to co-exist in a single chip package. The semiconductor company is taking a modular approach to chip design with the option for customers to cram computing blocks such as CPUs, GPUs and AI accelerators inside a single chip package. Read more…

Industry Consortium Forms to Drive UCIe Chiplet Interconnect Standard

March 2, 2022

A new industry consortium aims to establish a die-to-die interconnect standard – Universal Chiplet Interconnect Express (UCIe) – in support of an open chipl Read more…

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Whitepaper

HPC in a Global Weather Environment

Between 2012 and 2022, CoreHive Computing collaborated with IBM in upgrading the National Oceanic and Atmospheric Administration’s (NOAA) Weather and Climate Operational Supercomputing System (WCOSS). Among the most powerful high-performance computing (HPC) systems in the world, WCOSS plays a vital role in providing forecasts, watches, warnings, and sharing data for public and international use.

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