As high performance computing capabilities and data centers expand, so does the heat they generate. Liquid cooling is one of the most efficient methods for managing this thermal output. With its broadened use, companies are looking to optimize liquid cooling performance and efficiency. One important advancement in this arena is replacing traditional metal quick disconnects (QDs) with lighter weight high-performance polymer QDs. Manufactured from polyphenylsulfone (PPSU), these next generation QDs deliver exceptional heat resistance, tensile strength, hydrolytic stability, impact resistance and broad chemical compatibility in a durable, non-spill connector. CPC offers the industry’s first and only PPSU QD purpose-built for liquid cooling use in HPC and data centers—the PLQ2 Series.
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