The folks at Intersect360 Research released their latest report and market update just ahead of ISC 2023, which was held in Hamburg, Germany, last week. The headline: “We’re returning to stab …
In the wake of SC22 last year, HPCwire wrote that “the conference’s eyes had shifted to carbon emissions and energy intensity” rather than the historical emphasis on flops-per-watt and powe …
Vote for your favorite candidates in 22 categories recognizing the most outstanding individuals, organizations, products, and technologies in the industry.
May 28, 2023
We in HPC sometimes roll our eyes at the term “AI supercomputer,” but a new system from Nvidia might live up to the moniker: the DGX GH200 AI supercomputer. Read more…
May 18, 2023
2023 finds every major tech player working furiously to build out tools and infrastructure amid the massive surge in large-language models (LLMs). Long-time AI Read more…
April 18, 2023
The ax returns to Intel – and this time, it’s taking out the troubled chip giant’s Data Center Solutions Group (DSG). The group, which offered datacenter Read more…
April 5, 2023
MLCommons today released the latest MLPerf Inferencing (v3.0) results for the datacenter and edge. While Nvidia continues to dominate the results – topping al Read more…
March 14, 2023
Four years after passing the U.S. National Quantum Initiative Act and decades after early quantum development and commercialization efforts started – think D- Read more…
January 11, 2023
The slowing of Moore’s law, rising energy costs and increasing climate regulations have led to ever-larger and ever-more-consequential energy footprints for d Read more…
December 21, 2022
Intel's ongoing reorganization has a new victim: the AXG group – which was formed in 2021 – is now mincemeat after it was chopped up on Wednesday. The consumer graphics portion of AXG (Accelerated Computing Systems and Graphics Group) will fold into the client computing group, while the enterprise accelerated computing operations of AXG will move over the data center group. Read more…
December 16, 2022
The European Union will release €270 million in funds as it tries to attain technology independence by building chips based on the open RISC-V instruction set Read more…
Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC processing generate excessive heat which results in higher data center power consumption and additional data center costs.
Data centers traditionally use air cooling solutions including heatsinks and fans that may not be able to reduce energy consumption while maintaining infrastructure performance for AI and HPC workloads. Liquid cooled systems will be increasingly replacing air cooled solutions for data centers running HPC and AI workloads to meet heat and performance needs.
QCT worked with Intel to develop the QCT QoolRack, a rack-level direct-to-chip cooling solution which meets data center needs with impressive cooling power savings per rack over air cooled solutions, and reduces data centers’ carbon footprint with QCT QoolRack smart management.
© 2023 HPCwire. All Rights Reserved. A Tabor Communications Publication
HPCwire is a registered trademark of Tabor Communications, Inc. Use of this site is governed by our Terms of Use and Privacy Policy.
Reproduction in whole or in part in any form or medium without express written permission of Tabor Communications, Inc. is prohibited.